⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10943226 | 0.84 | — | — | |
| SCHEMBL11654487 | 0.82 | DNM1 (0.59) | — | |
| SCHEMBL7592695 | 0.81 | — | — | |
| SCHEMBL6977413 | 0.81 | — | — | |
| SCHEMBL8399166 | 0.80 | DNM1 (0.63) | — | |
| SCHEMBL6872756 | 0.80 | DNM1 (0.63) | — | |
| SCHEMBL5611466 | 0.80 | — | — | |
| SCHEMBL17278299 | 0.79 | — | — | |
| SCHEMBL11895154 | 0.79 | — | — | |
| Hydrochloric Acid SCHEMBL3510110 | 0.79 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9809489-B2 | Composition for forming a conductive film, a conductive film, a method for producing a plating film, a plating film, and an electronic device | JSR CORPORATION (JP) | 2017-11-07 | — | — | US | disclosed |
| US-9543201-B2 | Method for forming three-dimensional interconnection, circuit arrangement comprising three-dimensional interconnection, and metal film-forming composition for three-dimensional interconnection | JSR CORPORATION (JP) | 2017-01-10 | — | — | US | disclosed |
| US-20160081189-A1 | COMPOSITION FOR FORMING A CONDUCTIVE FILM, A CONDUCTIVE FILM, A METHOD FOR PRODUCING A PLATING FILM, A PLATING FILM, AND AN ELECTRONIC DEVICE | JSR CORPORATION (JP) | 2016-03-17 | — | — | US | disclosed |
| US-20160064280-A1 | METHOD FOR FORMING THREE-DIMENSIONAL INTERCONNECTION, CIRCUIT ARRANGEMENT COMPRISING THREE-DIMENSIONAL INTERCONNECTION, AND METAL FILM-FORMING COMPOSITION FOR THREE-DIMENSIONAL INTERCONNECTION | JSR CORPORATION (JP) | 2016-03-03 | — | — | US | disclosed |
| EP-2168973-A1 | Nucleic acid ligand complexes | Gilead Sciences, Inc. (US) | 2010-03-31 | — | — | EP | disclosed |
| WO-2009061781-A1 | NOVEL MODULATORS OF CELL CYCLE CHECKPOINTS AND THEIR USE IN COMBINATION WITH CHECKPOINT KINASE INHIBITORS | SCHERING CORPORATION (US) | 2009-05-14 | — | — | WO | disclosed |
| EP-0818512-B1 | Quinoline derivative and use of same | MITSUI CHEMICALS INC (JP) | 2002-10-02 | — | — | EP | disclosed |
| US-6407242-B1 | REACTING A PHTHALIMIDE COMPOUND WITH A QUINOLINE COMPOUND;ELECTROLUMINESCENCE | MITSUI CHEMICALS, INC. (JP) | 2002-06-18 | — | — | US | disclosed |
| US-6132640-A | ZINC COMPLEXES OF QUINOLINE | MITSUI CHEMICALS, INC. (JP) | 2000-10-17 | — | — | US | disclosed |
| EP-0818512-A1 | Quinoline derivative and use of same | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1998-01-14 | — | — | EP | disclosed |