Piperidine

Piperidine

SCHEMBL750014

B.C1CCNCC1

nearest known ligand 0.00

Full drug profile on Sugi Atlas →

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Piperidine SCHEMBL28144023 0.95
Piperidine SCHEMBL11539954 0.95
Piperidine SCHEMBL28335742 0.95
Piperidine SCHEMBL15135065 0.95 ALDH1A1 (0.82)
Piperidine SCHEMBL18091190 0.95 ALDH1A1 (0.82)
Pyrrolidine SCHEMBL28472533 0.95 ALDH1A1 (0.80)
Pyrrolidine SCHEMBL28515458 0.95 ALDH1A1 (0.80)
Pyrrolidine SCHEMBL3410312 0.95
SCHEMBL8253733 0.95 ALDH1A1 (1.00)
SCHEMBL3069642 0.95 ALDH1A1 (1.00)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 415 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2590758-B1 METHODS OF TREATING METAL SURFACES ATOTECH DEUTSCHLAND GMBH (DE) 2020-06-10 EP claimed
US-10375835-B2 Methods of treating metal surfaces and devices formed thereby ATOTECH DEUTCHLAND GMBH (DE) 2019-08-06 US claimed
EP-2591645-B1 METHODS OF TREATING COPPER SURFACES FOR ENHANCING ADHESION TO ORGANIC SUBSTRATES FOR USE IN PRINTED CIRCUIT BOARDS NAMICS CORP (JP) 2018-09-05 EP claimed
CN-108368206-A Include polymer composition, the Its Preparation Method And Use of the cross-linked polymer containing the borate functional group that can swap reaction 巴黎市工业物理化学学校 2018-08-03 CN claimed
CN-108329359-A Organic electroluminescent material and device 环球展览公司 2018-07-27 CN claimed
CN-108102503-A Metal leaching molding composition and preparation method thereof 苏州甫众塑胶有限公司 2018-06-01 CN claimed
US-9795040-B2 Methods of treating copper surfaces for enhancing adhesion to organic substrates for use in printed circuit boards NAMICS CORPORATION (JP) 2017-10-17 US claimed
CN-103120037-B Method of treating copper surfaces to enhance adhesion to organic substrates used in printed circuit boards 纳美仕有限公司 2017-05-10 CN claimed
US-20170027065-A1 Methods Of Treating Copper Surfaces For Enhancing Adhesion To Organic Substrates For Use In Printed Circuit Boards NAMICS CORPORATION (JP) 2017-01-26 US claimed
US-20160360623-A1 METHODS OF TREATING METAL SURFACES AND DEVICES FORMED THEREBY ATOTECH DEUTSCHLAND GMBH & CO. KG (F/K/A ATOTECH DEUTSCHLAND GMBH) (DE) 2016-12-08 US claimed
EP-0979208-A4 COMPOSITION AND METHOD FOR REDUCING COPPER OXIDE TO METALLIC COPPER MORTON INT INC (US) 2000-10-25 EP claimed
US-6086956-A Composition and method for reducing copper oxide to metallic copper MORTON INTERNATIONAL INC. (US) 2000-07-11 US claimed
CN-1248958-A Composition and method for reducing copper oxide to metallic copper MORTON INT INC (US) 2000-03-29 CN claimed
EP-0979208-A1 COMPOSITION AND METHOD FOR REDUCING COPPER OXIDE TO METALLIC COPPER MORTON INTERNATIONAL, INC. (US) 2000-02-16 EP claimed
WO-1999042402-A1 COMPOSITION AND METHOD FOR REDUCING COPPER OXIDE TO METALLIC COPPER MORTON INTERNATIONAL, INC. (US) 1999-08-26 WO claimed
EP-0922050-A1 3-DESCLADINOSE-2,3-ANHYDROERYTHROMYCIN DERIVATIVES ABBOTT LABORATORIES (US) 1999-06-16 EP claimed
US-5900186-A BONDING COPPER TO RESIN USING CYCLIC BORANE REDUCTING AGENT MORTON INTERNATIONAL, INC. (US) 1999-05-04 US claimed
US-5753309-A CYCLIC BORANE REDUCING AGENTS SURFACE TEK SPECIALTY PRODUCTS, INC. (US) 1998-05-19 US claimed
US-5750510-A ANTIBIOTICS ABBOTT LABORATORIES (US) 1998-05-12 US claimed
WO-1997042205-A1 3-DESCLADINOSE-2,3-ANHYDROERYTHROMYCIN DERIVATIVES ABBOTT LABORATORIES (US) 1997-11-13 WO claimed