SCHEMBL751062

SCHEMBL751062

CCC(CC(CC)C(=O)O)C(=O)O

nearest known ligand 0.71

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SLC1A2 P43004 5/20 0.71
SLC1A3 P43003 4/20 0.71
SLC1A1 P43005 4/20 0.71
CA2 P00918 1/20 0.59
MAPK1 P28482 1/20 0.59
CHRM1 P11229 1/20 0.55
AKR1A1 P14550 1/20 0.55
CHRM3 P20309 1/20 0.55
HTR2A P28223 1/20 0.55
HTR2C P28335 1/20 0.55
ADRA1A P35348 1/20 0.55
HRH1 P35367 1/20 0.55
DRD3 P35462 1/20 0.55
SLC6A3 Q01959 1/20 0.55
HDAC1 Q13547 1/20 0.55
HDAC2 Q92769 1/20 0.55
TDP1 Q9NUW8 1/20 0.55
GRIK1 P39086 6/20 0.46
GRIK2 Q13002 6/20 0.46
USP2 O75604 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13317543 0.97 SLC1A2 (0.68) SLC1A2SLC1A3SLC1A1CA2MAPK1
SCHEMBL15217711 0.97 SLC1A2 (0.68) SLC1A2SLC1A3SLC1A1CA2MAPK1
SCHEMBL4856341 0.97 SLC1A2 (0.68) SLC1A2SLC1A3SLC1A1CA2MAPK1
SCHEMBL6114 0.90
SCHEMBL14224981 0.89 SLC1A2 (0.60) SLC1A2SLC1A3SLC1A1CA2MAPK1
SCHEMBL12950308 0.89 SLC1A2 (0.60) SLC1A2SLC1A3SLC1A1CA2MAPK1
SCHEMBL12191525 0.89 SLC1A3 (0.60) SLC1A2SLC1A3SLC1A1CA2MAPK1
SCHEMBL5970448 0.89 SLC1A2 (0.60) SLC1A2SLC1A3SLC1A1CA2MAPK1
SCHEMBL807054 0.89 SLC1A3 (0.60) SLC1A2SLC1A3SLC1A1CA2MAPK1
SCHEMBL322526 0.89 SLC1A3 (0.60) SLC1A2SLC1A3SLC1A1CA2MAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 482 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12427607-B2 Flux and solder paste SENJU METAL INDUSTRY CO., LTD. (JP) 2025-09-30 US claimed
US-12365054-B2 Flux and solder paste SENJU METAL INDUSTRY CO., LTD. 2025-07-22 US claimed
CN-118176084-B Soldering flux and method for producing bonded body 千住金属工业株式会社 2025-03-18 CN claimed
US-12172243-B2 Flux, resin flux cored solder using the flux, and soldering method SENJU METAL INDUSTRY CO., LTD. (JP) 2024-12-24 US claimed
CN-118755080-A Preparation method of polyamide 66 with high strength and high elongation at break 江苏扬农化工集团有限公司 2024-10-11 CN claimed
CN-118307737-A Degradable and recyclable polyether polyurethane and preparation method thereof 华南理工大学 2024-07-09 CN claimed
CN-117209778-A Method for preparing polyalkyl aluminoxane by non-hydrolytic method, polyalkyl aluminoxane and application thereof 万华化学集团股份有限公司 2023-12-12 CN claimed
CN-110878139-B Low-melting-point high-flow ternary random copolymer polyamide modified base resin and preparation method thereof 华峰集团有限公司 2022-06-17 CN claimed
CN-111601678-B Flux and solder paste 千住金属工业株式会社 2022-02-25 CN claimed
CN-107857877-B High-fluidity polyhexamethylene adipamide modified base resin and preparation method thereof 华峰集团有限公司 2020-09-04 CN claimed
CN-110878139-A Low-melting-point high-flow ternary random copolymer polyamide modified base resin and preparation method thereof 华峰集团有限公司 2020-03-13 CN claimed
EP-1788049-B1 THERMOSETTING AQUEOUS COATING COMPOSITION KANSAI PAINT CO LTD (JP) 2014-05-21 EP claimed
US-8648120-B2 Liquid rheology modifier KAO CORPORATION (JP) 2014-02-11 US claimed
US-7838076-B2 Thermosetting aqueous paint composition KANSAI PAINT CO., LTD. (JP) 2010-11-23 US claimed
US-20080095944-A1 Thermosetting Aqueous Paint Composition KANSAI PAINT CO., LTD. (JP) 2008-04-24 US claimed
EP-1788049-A1 THERMOSETTING AQUEOUS COATING COMPOSITION Kansai Paint Co., Ltd. (JP) 2007-05-23 EP claimed
EP-1193293-B1 Resin composition KYOWA YUKA KK (JP) 2006-03-01 EP claimed
US-6512057-B2 Resin composition KYOWA YUKA CO., LTD. (JP) 2003-01-28 US claimed
US-12605794-B2 Flux and solder paste SENJU METAL INDUSTRY CO., LTD. (JP) 2026-04-21 US disclosed
EP-1193293-A1 Resin composition Kyowa Yuka Co., Ltd. (JP) 2002-04-03 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12605794-B2 Flux and solder paste RIOK2, TRA2B, BAG2 SLC1A2 947/4885SLC1A3 1738/4885SLC1A1 2322/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.