SCHEMBL751504

SCHEMBL751504

C=C(C)C(=O)OC(C)C(O)COC(=O)c1ccccc1C(=O)OCC(O)C(C)OC(=O)C(=C)C

nearest known ligand 0.54

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
TSHR P16473 6/20 0.54
ALDH1A1 P00352 4/20 0.54
CYP3A4 P08684 3/20 0.42
CA2 P00918 1/20 0.42
ADRB2 P07550 7/20 0.41
ADRB1 P08588 7/20 0.41
ADRB3 P13945 7/20 0.41
PRSS1 P07477 1/20 0.40
PRSS2 P07478 1/20 0.40
PRSS3 P35030 1/20 0.40
TDP1 Q9NUW8 1/20 0.39
L3MBTL1 Q9Y468 1/20 0.39
TP53 P04637 1/20 0.38
MAPK1 P28482 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3915386 0.84 TSHR (0.63) TSHRALDH1A1CYP3A4CA2ADRB2
SCHEMBL25424391 0.84 TSHR (0.54) TSHRALDH1A1CYP3A4CA2ADRB2
SCHEMBL11062033 0.83 TSHR (0.54) TSHRALDH1A1CYP3A4CA2ADRB2
SCHEMBL28634846 0.82 TSHR (0.56) TSHRALDH1A1CYP3A4CA2ADRB2
SCHEMBL3268991 0.81 TSHR (0.51) TSHRALDH1A1CYP3A4CA2ADRB2
SCHEMBL25438702 0.81 TSHR (0.51) TSHRALDH1A1CYP3A4CA2ADRB2
SCHEMBL35051 0.81 TSHR (0.54) TSHRALDH1A1CYP3A4CA2ADRB2
SCHEMBL696763 0.81 TSHR (0.43) TSHRALDH1A1CYP3A4TDP1L3MBTL1
SCHEMBL3676540 0.80 TSHR (0.60) TSHRALDH1A1
SCHEMBL2531577 0.80 TSHR (0.56) TSHRALDH1A1CYP3A4CA2ADRB2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5707543-A LIGHT SCATTERING AND RADIATION TRANSPARENT MEDIUM ON SUBSTRATES FOR OPTICAL RECORDING MEDIA USING LIQUID CRYSTALS FUJI XEROX CO., LTD. (JP) 1998-01-13 US claimed
US-20250155808-A1 RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN ZEON CORPORATION (JP) 2025-05-15 US disclosed
US-10023712-B2 Heat-expandable microspheres, process for producing the same and application thereof MATSUMOTO YUSHI-SEIYAKU CO., LTD. (JP) 2018-07-17 US disclosed
EP-2431150-B1 TRANSFER SHEET AND PROCESS FOR PRODUCING SAME DAIKIN IND LTD (JP) 2017-08-23 EP disclosed
US-20170218151-A1 TRANSFER SHEET AND PROCESS FOR PRODUCING SAME DAIKIN INDUSTRIES, LTD. (JP) 2017-08-03 US disclosed
US-20170190157-A1 RESIN PRODUCT MITSUBISHI RAYON CO., LTD. (JP) 2017-07-06 US disclosed
EP-3150657-A1 RESIN PRODUCT Mitsubishi Rayon Co., Ltd. (JP) 2017-04-05 EP disclosed
US-20170081492-A1 HEAT-EXPANDABLE MICROSPHERES, PROCESS FOR PRODUCING THE SAME AND APPLICATION THEREOF MATSUMOTO YUSHI-SEIYAKU CO., LTD. (JP) 2017-03-23 US disclosed
US-8796397-B2 Silicone resin, process for producing the same, and curable resin composition comprising the same NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD. (JP) 2014-08-05 US disclosed
US-8754181-B2 Silicone resin, process for producing the same, and curable resin composition comprising the same NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD. (JP) 2014-06-17 US disclosed
EP-1411073-B1 SURFACE-TREATING AGENT COMPOSITION AND PROCESS FOR PRODUCING THE SAME DAIKIN IND LTD (JP) 2013-03-20 EP disclosed
US-20120100369-A1 TRANSFER SHEET AND PROCESS FOR PRODUCING SAME DAIKIN INDUSTRIES, LTD. (JP) 2012-04-26 US disclosed
EP-2431150-A1 TRANSFER SHEET AND PROCESS FOR PRODUCING SAME Daikin Industries, Ltd. (JP) 2012-03-21 EP disclosed
US-20100311919-A1 SILICONE RESIN, PROCESS FOR PRODUCING THE SAME, AND CURABLE RESIN COMPOSITION COMPRISING THE SAME NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD. (JP) 2010-12-09 US disclosed
US-6906115-B2 Surface treatment composition and preparation thereof DAIKIN INDUSTRIES, LTD. (JP) 2005-06-14 US disclosed
US-20040181008-A1 Surface-treating agent composition and process for producing the same DAIKIN INDUSTRIES, LTD. (JP) 2004-09-16 US disclosed
EP-1411073-A1 SURFACE-TREATING AGENT COMPOSITION AND PROCESS FOR PRODUCING THE SAME Daikin Industries, Ltd. (JP) 2004-04-21 EP disclosed
EP-0348063-B1 THERMOPLASTIC ELASTOMER AND PHOTOSENSITIVE RESIN COMPOSITION BASED THEREON, AND PRINTING PLATE PRECURSOR COMPRISING THE COMPOSITION Asahi Kasei Kogyo Kabushiki Kaisha (JP) 1993-05-26 EP disclosed
US-5177171-A SULFONIC ACID GROUP-CONTAINING POLYURETHANE AND A PHOTOSENSITIVE RESIN COMPOSITION CONTAINING THE SAME ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1993-01-05 US disclosed
US-5053316-A THERMOPLASTIC ELASTOMER AND PHOTOSENSITIVE RESIN COMPOSITION BASED THEREON, AND PRINTING PLATE PRECURSOR COMPRISING THE COMPOSITION ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1991-10-01 US disclosed