SCHEMBL7522129

SCHEMBL7522129

Oc1cc(I)cc(O)c1I

nearest known ligand 0.47

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
TTR P02766 1/20 0.47
ACE P12821 1/20 0.42
PTGS1 P23219 1/20 0.42
GABRA1 P14867 1/20 0.38
GABRB1 P18505 1/20 0.38
GABRB2 P47870 1/20 0.38
ERN1 O75460 2/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4961622 0.84 TTR (0.55) TTRACEPTGS1GABRA1GABRB1
SCHEMBL14723464 0.79 PTGS1 (0.48) TTRACEPTGS1
SCHEMBL6349605 0.79 TTR (0.56) TTRGABRA1GABRB1GABRB2ERN1
SCHEMBL23600930 0.74 CA1 (0.40)
SCHEMBL16586690 0.73 ACHE (0.58) TTRGABRA1GABRB1GABRB2ERN1
SCHEMBL16621851 0.73 SELL (0.58) TTRACEPTGS1ERN1
SCHEMBL18341938 0.73 CA9 (0.45) TTRACEPTGS1ERN1
SCHEMBL31120248 0.73 CYP3A4 (0.43) ACEPTGS1GABRA1GABRB1GABRB2
SCHEMBL1458547 0.73 HSD17B10 (0.46) TTRGABRA1GABRB1GABRB2ERN1
SCHEMBL6871795 0.69 ACHE (0.50) TTRACEPTGS1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-1157355-C Novel ester compound and themrosetting resin composition using the same ס�ѻ�ѧ��ҵ��ʽ���� 2004-07-14 CN disclosed
CN-1155655-C Arylester compound and its prep, epoxy resin composition using the compound and copper-coated laminated ס�ѻ�ѧ��ҵ��ʽ���� 2004-06-30 CN disclosed
US-6469109-B2 COPPER CLAD LAMINATES SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2002-10-22 US disclosed
EP-0699670-B1 Aryl ester compound, its production process, epoxy resin composition using said compound, and copper-clad laminate using the epoxy resin composition SUMITOMO CHEMICAL CO (JP) 2002-03-06 EP disclosed
US-20020010288-A1 Copper clad laminates UEDA YOUICHI (JP) 2002-01-24 US disclosed
US-6270899-B1 AS CURING AGENT FOR EPOXY RESIN SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2001-08-07 US disclosed
CN-1284521-A Aromatic ester compound and its prep., expoxy resin composition using the same and coper-coated laminate SUMITOMO CHEMICAL CO (JP) 2001-02-21 CN disclosed
CN-1284520-A Arylester compound and its prep, epoxy resin composition using the compound and copper-coated laminated SUMITOMO CHEMICAL CO (JP) 2001-02-21 CN disclosed
CN-1060771-C Aryl ester compound, process for producing the same, epoxy resin composition using the same, and copper-clad laminate using the same SUMITOMO CHEMICAL CO (JP) 2001-01-17 CN disclosed
EP-0811619-B1 Novel ester compound and thermosetting resin composition using the same SUMITOMO CHEMICAL CO (JP) 2000-09-27 EP disclosed
US-5916683-A Copper-clad laminate with prepreg of epoxy resin and aryl ester SUMITOMO CHEMICAL COMPANY, LTD. (JP) 1999-06-29 US disclosed
US-5726257-A Esterified resorcinol-carbonyl compound condensates and epoxy resins therewith SUMITOMO CHEMICAL COMPANY, LTD. (JP) 1998-03-10 US disclosed
CN-1170710-A Novel ester compound and themrosetting resin composition using the same SUMITOMO CHEMICAL CO (JP) 1998-01-21 CN disclosed
EP-0811619-A1 Novel ester compound and thermosetting resin composition using the same SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1997-12-10 EP disclosed
CN-1125218-A Novel aryl ester compound, process for producing the same, epoxy resin composition using the same, and copper-clad laminate using the same SUMITOMO CHEMICAL CO (JP) 1996-06-26 CN disclosed
EP-0699670-A2 Aryl ester compound, its production process, epoxy resin composition using said compound, and copper-clad laminate using the epoxy resin composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1996-03-06 EP disclosed