SCHEMBL7524022

SCHEMBL7524022

CC1CN1C(=O)N1CC1C

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 4/20 0.52
MAPT P10636 1/20 0.52
GAA P10253 2/20 0.48
SMN1; SMN2 Q16637 1/20 0.46
LIPE Q05469 1/20 0.33
LMNA P02545 2/20 0.32
TP53 P04637 1/20 0.32
ALOX15 P16050 1/20 0.32
HSD17B10 Q99714 1/20 0.32
CPS1 P31327 1/20 0.32
HPGD P15428 1/20 0.31
NSD2 O96028 1/20 0.31
RECQL P46063 1/20 0.31
HTT P42858 1/20 0.31
L3MBTL1 Q9Y468 1/20 0.31
CHRNB2 P17787 1/20 0.30
CHRNA3 P32297 1/20 0.30
CHRNA4 P43681 1/20 0.30
CHRNB3 Q05901 1/20 0.30
CHRNA6 Q15825 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL220386 0.78
SCHEMBL14145678 0.78
SCHEMBL20820011 0.78
SCHEMBL20820009 0.78
SCHEMBL24677876 0.75 TSHR (0.54) TSHRMAPTGAASMN1; SMN2CPS1
SCHEMBL8362604 0.75
SCHEMBL29942704 0.75 TSHR (0.54) TSHRMAPTGAASMN1; SMN2LMNA
SCHEMBL11069033 0.75
SCHEMBL29942458 0.75 TSHR (0.54) TSHRMAPTGAASMN1; SMN2LMNA
SCHEMBL673795 0.73 SMN1; SMN2 (0.58) TSHRMAPTGAASMN1; SMN2LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4985584-A RING OPENING REACTION WITH N2O4 OR N2O5 SECRETARY OF STATE FOR DEFENCE (GB) 1991-01-15 US claimed
EP-0857584-B1 Heat-sensitive transfer medium GEN CO LTD (JP) 2002-04-17 EP disclosed
US-6150008-A FIRST RESIN CAPABLE OF CURING UPON REACTION WITH A CURING AGENT, A CURING AGENT, AND A SECOND RESIN CAPABLE OF INHIBITING THE REACTION OF THE FIRST RESIN WITH THE CURING AGENT GENERAL CO., LTD. (JP) 2000-11-21 US disclosed
EP-0857584-A1 Heat-sensitive transfer medium GENERAL COMPANY LIMITED (JP) 1998-08-12 EP disclosed
US-5530031-A Water-insoluble melamine-formaldehyde resins BASF AKTIENGESELLSCHAFT (DE) 1996-06-25 US disclosed
US-5015698-A Polyphenylene ether-polyester copolymers, precursors therefor, compositions containing said copolymers, and methods for their preparation GENERAL ELECTRIC COMPANY (US) 1991-05-14 US disclosed
EP-0223440-B1 A PROCESS FOR THE PRODUCTION OF HIGH ENERGY MATERIAL The Secretary of State for Defence in Her Britannic Majesty's Government of the United Kingdom of Great Britain and (GB) 1991-03-06 EP disclosed
US-4985584-A RING OPENING REACTION WITH N2O4 OR N2O5 SECRETARY OF STATE FOR DEFENCE (GB) 1991-01-15 US disclosed
EP-0248263-A2 Polyphenylene ether-polyester copolymers precursors therefor, compositions containing said copolymers, and methods for their preparation GENERAL ELECTRIC COMPANY (US) 1987-12-09 EP disclosed
EP-0223440-A1 A process for the production of high energy material The Secretary of State for Defence in Her Britannic Majesty's Government of the United Kingdom of Great Britain and (GB) 1987-05-27 EP disclosed