Predicted protein targets (top 14)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.38 |
| ▸ | BCL2L1 | Q07817 | 2/20 | 0.37 |
| ▸ | NUDT1 | P36639 | 1/20 | 0.35 |
| ▸ | BACE1 | P56817 | 1/20 | 0.35 |
| ▸ | BCL2 | P10415 | 1/20 | 0.33 |
| ▸ | MCL1 | Q07820 | 1/20 | 0.33 |
| ▸ | BCL2A1 | Q16548 | 1/20 | 0.33 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.32 |
| ▸ | MEN1 | O00255 | 1/20 | 0.32 |
| ▸ | MAPT | P10636 | 1/20 | 0.32 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.32 |
| ▸ | PSMB5 | P28074 | 1/20 | 0.31 |
| ▸ | PTPN5 | P54829 | 2/20 | 0.30 |
| ▸ | PTPN2 | P17706 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7522760 | 0.86 | HSP90AA1 (0.38) | HSP90AA1BCL2L1NUDT1BACE1BCL2 | |
| SCHEMBL9137211 | 0.84 | NUDT1 (0.34) | HSP90AA1BCL2L1NUDT1BACE1BCL2 | |
| SCHEMBL3787021 | 0.84 | NUDT1 (0.40) | HSP90AA1BCL2L1NUDT1BACE1KDM4E | |
| SCHEMBL3788958 | 0.82 | NUDT1 (0.37) | HSP90AA1BCL2L1NUDT1BACE1KDM4E | |
| Ethane SCHEMBL28262859 | 0.81 | NUDT1 (0.39) | HSP90AA1BCL2L1NUDT1BACE1KDM4E | |
| SCHEMBL18948598 | 0.80 | NUDT1 (0.42) | HSP90AA1NUDT1BACE1KDM4EMEN1 | |
| SCHEMBL3787886 | 0.78 | NUDT1 (0.44) | HSP90AA1NUDT1BACE1KDM4EMEN1 | |
| Ethane SCHEMBL28232501 | 0.78 | HDAC4 (0.36) | HSP90AA1NUDT1BACE1KDM4EMEN1 | |
| SCHEMBL5140179 | 0.77 | HSP90AA1 (0.35) | HSP90AA1NUDT1BACE1KDM4EMEN1 | |
| Orthocresol SCHEMBL15511894 | 0.77 | NUDT1 (0.39) | HSP90AA1NUDT1BACE1KDM4EMEN1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 45 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-5501936-A | IMPROVED RESOLUTION OF VERY FINE PATTERNS | TOKYO OHKA KOGYO CO., LTD. (JP) | 1996-03-26 | — | — | US | claimed |
| US-5434031-A | Positive-working naphthoquinone diazide photoresist composition containing specific hydroxy compound additive | TOKYO OHKA KOGYO CO., LTD. (JP) | 1995-07-18 | — | — | US | claimed |
| EP-3896522-B1 | PRODUCTION METHOD FOR SEMICONDUCTOR SUBSTRATE | TOKYO OHKA KOGYO CO LTD (JP) | 2023-05-03 | — | — | EP | disclosed |
| EP-3896522-A1 | PRODUCTION METHOD FOR SEMICONDUCTOR SUBSTRATE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2021-10-20 | — | — | EP | disclosed |
| US-10168617-B2 | Composition for forming interlayer insulating film, interlayer insulating film, method for forming interlayer insulating film pattern, and device | TOKYO OHKA KOGYO CO., LTD. (JP) | 2019-01-01 | — | — | US | disclosed |
| US-10162260-B2 | Photosensitive resin composition, protective film, and liquid crystal display element | CHI MEI CORPORATION (TW) | 2018-12-25 | — | — | US | disclosed |
| US-10156787-B2 | Composition for forming interlayer insulating film, interlayer insulating film, method for forming interlayer insulating film pattern, and device | TOKYO OHKA KOGYO CO., LTD. (JP) | 2018-12-18 | — | — | US | disclosed |
| US-10067422-B2 | Photosensitive resin composition for forming interlayer insulating film, interlayer insulating film, and method for forming interlayer insulating film | TOKYO OHKA KOGYO CO. LTD. (JP) | 2018-09-04 | — | — | US | disclosed |
| US-9851638-B2 | Photosensitive polysiloxane composition and uses thereof | CHI MEI CORPORATION (TW) | 2017-12-26 | — | — | US | disclosed |
| US-20170285473-A1 | COMPOSITION FOR FORMING INTERLAYER INSULATING FILM, INTERLAYER INSULATING FILM, METHOD FOR FORMING INTERLAYER INSULATING FILM PATTERN, AND DEVICE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2017-10-05 | — | — | US | disclosed |
| US-20170285472-A1 | COMPOSITION FOR FORMING INTERLAYER INSULATING FILM, INTERLAYER INSULATING FILM, METHOD FOR FORMING INTERLAYER INSULATING FILM PATTERN, AND DEVICE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2017-10-05 | — | — | US | disclosed |
| EP-0848289-B1 | Negative-working chemical sensitization photoresist composition | TOKYO OHKA KOGYO CO LTD (JP) | 2002-02-27 | — | — | EP | disclosed |
| EP-0848289-A1 | Negative-working chemical sensitization photoresist composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 1998-06-17 | — | — | EP | disclosed |
| US-5601961-A | QUINONE DIAZIDE GROUP-CONTAINING COMPOUND AS PHOTOSENSITIZING AGENT, ALKALI-SOLUBLE RESINOUS INGREDIENT AS FILM-FORMING AGENT MADE FROM A BLEND OF AT LEAST TWO NOVOLAK-TYPE RESINS FROM M-AND P-CRESOL, A XYLENOL AND A TRIMETHYLPHENOL | TOKYO OHKA KOGYO CO., LTD. (JP) | 1997-02-11 | — | — | US | disclosed |
| US-5576138-A | MIXTURE OF RESIN, PHOTOSENSITIZER AND BENZOPHENONE COMPOUND | TOKYO OHKA KOGYO CO., LTD. (JP) | 1996-11-19 | — | — | US | disclosed |
| US-5501936-A | IMPROVED RESOLUTION OF VERY FINE PATTERNS | TOKYO OHKA KOGYO CO., LTD. (JP) | 1996-03-26 | — | — | US | disclosed |
| US-5501936-A | IMPROVED RESOLUTION OF VERY FINE PATTERNS | TOKYO OHKA KOGYO CO., LTD. (JP) | 1996-03-26 | — | — | US | disclosed |
| US-5478692-A | Fine patterning for electronics | TOKYO OHKA KOGYO CO., LTD. (JP) | 1995-12-26 | — | — | US | disclosed |
| US-5434031-A | Positive-working naphthoquinone diazide photoresist composition containing specific hydroxy compound additive | TOKYO OHKA KOGYO CO., LTD. (JP) | 1995-07-18 | — | — | US | disclosed |
| US-5401605-A | Positive working photosensitive resin composition containing 1,2-naphthoquinone diazide esterification product of triphenylmethane compound | TOKYO OHKA KOGYO CO., LTD. (JP) | 1995-03-28 | — | — | US | disclosed |