SCHEMBL7526048

SCHEMBL7526048

C=C(C)c1ccccc1CC(C)C=O

nearest known ligand 0.37

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ELANE P08246 1/20 0.37
TSHR P16473 2/20 0.37
TP53 P04637 1/20 0.37
CAPN1 P07384 2/20 0.35
ALDH1A1 P00352 3/20 0.32
GABRA1 P14867 1/20 0.32
GABRB2 P47870 1/20 0.32
FOLH1 Q04609 2/20 0.31
LMNA P02545 2/20 0.31
L3MBTL1 Q9Y468 2/20 0.31
MAPT P10636 1/20 0.31
HPGD P15428 1/20 0.31
SMN1; SMN2 Q16637 1/20 0.31
MEN1 O00255 1/20 0.31
KMT2A Q03164 1/20 0.31
TAAR1 Q96RJ0 1/20 0.31
ADRA2A P08913 1/20 0.31
ADRA2B P18089 1/20 0.31
ADRA2C P18825 1/20 0.31
POLB P06746 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL714466 0.80 GABRA1 (0.50) TSHRALDH1A1GABRA1GABRB2FOLH1
SCHEMBL10622937 0.79 GABRA1 (0.35) TSHRALDH1A1GABRA1GABRB2FOLH1
SCHEMBL8676206 0.77 GABRA1 (0.34) TSHRALDH1A1GABRA1GABRB2FOLH1
SCHEMBL9723651 0.77 TAAR1 (0.44) KMT2ATAAR1ADRA2A
SCHEMBL3272345 0.75 TSHR (0.45) ELANETSHRTP53GABRA1GABRB2
SCHEMBL28466587 0.74 GABRA1 (0.47) ELANETSHRTP53GABRA1GABRB2
SCHEMBL29396009 0.74 GABRA1 (0.44) TSHRTP53ALDH1A1GABRA1GABRB2
SCHEMBL721894 0.74 GABRA1 (0.44) TSHRTP53ALDH1A1GABRA1GABRB2
SCHEMBL7933543 0.73 TSHR (0.42) ELANETSHRTP53ALDH1A1HPGD
SCHEMBL7526053 0.72 TSHR (0.54) ELANETSHRTP53ALDH1A1LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6469109-B2 COPPER CLAD LAMINATES SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2002-10-22 US disclosed
EP-0699670-B1 Aryl ester compound, its production process, epoxy resin composition using said compound, and copper-clad laminate using the epoxy resin composition SUMITOMO CHEMICAL CO (JP) 2002-03-06 EP disclosed
US-20020010288-A1 Copper clad laminates UEDA YOUICHI (JP) 2002-01-24 US disclosed
US-5916683-A Copper-clad laminate with prepreg of epoxy resin and aryl ester SUMITOMO CHEMICAL COMPANY, LTD. (JP) 1999-06-29 US disclosed
US-5726257-A Esterified resorcinol-carbonyl compound condensates and epoxy resins therewith SUMITOMO CHEMICAL COMPANY, LTD. (JP) 1998-03-10 US disclosed
EP-0699670-A2 Aryl ester compound, its production process, epoxy resin composition using said compound, and copper-clad laminate using the epoxy resin composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1996-03-06 EP disclosed