SCHEMBL7526154

SCHEMBL7526154

CC(C)(O)C1CCC(C(C)(C)O)CC1

nearest known ligand 0.42

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
LMNA P02545 1/20 0.42
CES2 O00748 2/20 0.38
HPGDS O60760 2/20 0.32
TRPA1 O75762 1/20 0.31
EPHX1 P07099 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL456619 1.00
SCHEMBL16216047 0.90 EPHX1 (0.40) LMNACES2EPHX1
SCHEMBL15472997 0.90 EPHX1 (0.40) LMNACES2EPHX1
SCHEMBL12303578 0.87 LMNA (0.37) LMNACES2
SCHEMBL13616892 0.87 LMNA (0.37) LMNACES2
SCHEMBL13559139 0.87 LMNA (0.37) LMNACES2
SCHEMBL13360079 0.87 LMNA (0.37) LMNACES2
SCHEMBL807045 0.87 LMNA (0.37) LMNACES2
SCHEMBL14639246 0.87 LMNA (0.37) LMNACES2
SCHEMBL3145985 0.86

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20140205947-A1 PATTERN FORMING METHOD, CHEMICAL AMPLIFICATION RESIST COMPOSITION AND RESIST FILM FUJIFILM CORPORATION (JP) 2014-07-24 US disclosed
US-20140205947-A1 PATTERN FORMING METHOD, CHEMICAL AMPLIFICATION RESIST COMPOSITION AND RESIST FILM FUJIFILM CORPORATION (JP) 2014-07-24 US disclosed
US-8722319-B2 Pattern forming method, chemical amplification resist composition and resist film FUJIFILM CORPORATION (JP) 2014-05-13 US disclosed
US-8722319-B2 Pattern forming method, chemical amplification resist composition and resist film FUJIFILM CORPORATION (JP) 2014-05-13 US disclosed
US-20120077122-A1 PATTERN FORMING METHOD, CHEMICAL AMPLIFICATION RESIST COMPOSITION AND RESIST FILM FUJIFILM CORPORATION (JP) 2012-03-29 US disclosed
US-20120077122-A1 PATTERN FORMING METHOD, CHEMICAL AMPLIFICATION RESIST COMPOSITION AND RESIST FILM FUJIFILM CORPORATION (JP) 2012-03-29 US disclosed
US-20020146515-A1 Aqueous compositions for coating metal components BASF AKTIENGESELLSCHAFT (DE) 2002-10-10 US disclosed
EP-1229086-A1 Utilisation of aqueous polymer dispersion compositions for the coating of metal objects BASF AKTIENGESELLSCHAFT (DE) 2002-08-07 EP disclosed
US-5448000-A Making sulfonic acid-terminated polyisobutylene by polymerizing isobutylene in presence of initiator, electron donor, solvent and Lewis acid, then end-quenching NEW MEXICO TECH RESEARCH FOUNDATION (US) 1995-09-05 US disclosed