SCHEMBL7536756

SCHEMBL7536756

CCCN1C(=O)N(CC2CO2)C(C)(C)C1=O

nearest known ligand 0.40

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
TP53 P04637 1/20 0.38
HBB P68871 1/20 0.38
SMN1; SMN2 Q16637 1/20 0.38
RAB9A P51151 1/20 0.35
HTR1A P08908 2/20 0.32
HTR7 P34969 2/20 0.32
HTR6 P50406 2/20 0.32
ALDH1A1 P00352 1/20 0.32
CYP19A1 P11511 2/20 0.30
PLA2G7 Q13093 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31228896 0.89 TP53 (0.39) TP53HBBSMN1; SMN2RAB9AHTR1A
SCHEMBL261620 0.87 TP53 (0.42) TP53HBBSMN1; SMN2RAB9AHTR1A
SCHEMBL11756952 0.86 TP53 (0.41) TP53HBBSMN1; SMN2RAB9AHTR1A
SCHEMBL11331039 0.84 TP53 (0.35) TP53HBBSMN1; SMN2RAB9AHTR1A
SCHEMBL24507049 0.83 TP53 (0.39) TP53HBBSMN1; SMN2RAB9AHTR1A
SCHEMBL10754802 0.82 RAB9A (0.34) TP53HBBSMN1; SMN2RAB9A
SCHEMBL11390391 0.82 TSHR (0.37) TP53HBBSMN1; SMN2HTR1AHTR7
SCHEMBL11828915 0.81 TP53 (0.30) TP53HBBSMN1; SMN2
SCHEMBL11342172 0.80 TSHR (0.41) TP53HBBSMN1; SMN2HTR1AHTR7
SCHEMBL11827895 0.80 TP53 (0.32) TP53HBBSMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11674063-B2 Epoxy resin adhesive compositions DDP SPECIALTY ELECTRONIC MATERIALS US, LLC (US) 2023-06-13 US disclosed
EP-4077463-A1 TWO PART CURABLE COMPOSITIONS Henkel AG & Co. KGaA (DE) 2022-10-26 EP disclosed
WO-2021127128-A1 TWO PART CURABLE COMPOSITIONS Henkel IP & Holding GmbH (DE) 2021-06-24 WO disclosed
US-20210062054-A1 EPOXY RESIN ADHESIVE COMPOSITIONS THE DOW CHEMICAL COMPANY 2021-03-04 US disclosed
US-20180057313-A1 ELEVATOR SUSPENSION AND TRANSMISSION STRIP THYSSENKRUPP ELEVATOR INNOVATION AND OPERATIONS GMBH (DE) 2018-03-01 US disclosed
EP-2912131-A1 ADHESIVE COMPOSITIONS Henkel IP & Holding GmbH (DE) 2015-09-02 EP disclosed
US-20140235758-A1 ADHESIVE COMPOSITIONS Henkel US IP LLC (US) 2014-08-21 US disclosed
WO-2014066315-A1 ADHESIVE COMPOSITIONS Henkel US IP LLC (US) 2014-05-01 WO disclosed
WO-2013074265-A1 ADHESIVE COMPOSITIONS HENKEL CORPORATION (US) 2013-05-23 WO disclosed
US-6489405-B1 CURABLE POLYOXYALKYLENE AMINES USED FOR ENCAPSULATION OF ELECTRICAL AND ELECTRONIC APPARATUS VANTICO, INC. 2002-12-03 US disclosed
US-20020160309-A1 Photocurable compositions with alicyclic epoxides of high monomer purity VANTICO INC. 2002-10-31 US disclosed
US-6350403-B1 AN ARTICLE PRODUCED BY STEREOLITHOGRAPHY AND RADIATION CURABLE WITH ACTINIC RADIATION VANTICO INC. 2002-02-26 US disclosed
US-6271463-B1 Use of expandable epoxy systems for barrier materials in high voltage liquid-filled transformers VANTICO INC. 2001-08-07 US disclosed
EP-1099138-A1 STEREOLITHOGRAPHIC COMPOSITIONS FOR PREPARING POLYETHYLENE-LIKE ARTICLES DSM N.V. (NL) 2001-05-16 EP disclosed
WO-2000003300-A1 STEREOLITHOGRAPHIC COMPOSITION FOR PREPARING POLYETHYLENE-LIKE ARTICLES DSM N.V. (NL) 2000-01-20 WO disclosed
EP-0642416-A4 FIBER/RESIN COMPOSITES AND METHOD OF PREPARATION. LOCTITE CORP (US) 1998-04-15 EP disclosed
EP-0642416-A1 FIBER/RESIN COMPOSITES AND METHOD OF PREPARATION LOCTITE CORPORATION (US) 1995-03-15 EP disclosed
WO-1994021455-A1 FIBER/RESIN COMPOSITES AND METHOD OF PREPARATION LOCTITE CORPORATION (US) 1994-09-29 WO disclosed
EP-0503864-A2 Coating compositions CIBA-GEIGY AG (CH) 1992-09-16 EP disclosed
EP-0266306-A2 Latent epoxide composition CIBA-GEIGY AG (CH) 1988-05-04 EP disclosed