Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27947159 | 0.97 | THRB (0.48) | THRBLMNA | |
| SCHEMBL27930062 | 0.97 | THRB (0.48) | THRBLMNA | |
| SCHEMBL27947163 | 0.97 | THRB (0.48) | THRBLMNA | |
| SCHEMBL27930149 | 0.97 | THRB (0.48) | THRBLMNA | |
| SCHEMBL10359501 | 0.97 | THRB (0.48) | THRBLMNA | |
| SCHEMBL27943259 | 0.90 | THRB (0.52) | THRBLMNA | |
| SCHEMBL21489520 | 0.90 | THRB (0.46) | THRBLMNA | |
| SCHEMBL27563808 | 0.90 | THRB (0.52) | THRBLMNA | |
| SCHEMBL1272295 | 0.90 | THRB (0.33) | THRB | |
| SCHEMBL29237005 | 0.88 | THRB (0.50) | THRBLMNA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 46 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117939964-A | Display device | 三星显示有限公司 | 2024-04-26 | — | — | CN | disclosed |
| CN-113056514-B | Heat conducting material | 北川工业株式会社 | 2023-03-10 | — | — | CN | disclosed |
| CN-110709439-B | Composition for heat conductive material and heat conductive material | 北川工业株式会社 | 2022-06-17 | — | — | CN | disclosed |
| CN-113056514-A | Heat conducting material | 北川工业株式会社 | 2021-06-29 | — | — | CN | disclosed |
| CN-110709439-A | Composition for heat conductive material and heat conductive material | 北川工业株式会社 | 2020-01-17 | — | — | CN | disclosed |
| EP-2594600-B1 | COMPOSITE MOLDED BODY AND METHOD FOR PRODUCING SAME | KANEKA CORP (JP) | 2018-05-16 | — | — | EP | disclosed |
| US-9708424-B2 | (Meth)acryloyl-terminated polyisobutylene polymer, method for producing the same, and active energy ray-curable composition | KANEKA CORPORATION (JP) | 2017-07-18 | — | — | US | disclosed |
| US-20170051093-A1 | (METH)ACRYLOYL-TERMINATED POLYISOBUTYLENE POLYMER, METHOD FOR PRODUCING THE SAME, AND ACTIVE ENERGY RAY-CURABLE COMPOSITION | KANEKA CORP (JP) | 2017-02-23 | — | — | US | disclosed |
| US-9512247-B2 | (Meth)acryloyl-terminated polyisobutylene polymer, method for producing the same, and active energy ray-curable composition | KANEKA CORPORATION (JP) | 2016-12-06 | — | — | US | disclosed |
| EP-2623531-B1 | COMPOSITION CONTAINING BRANCHED POLYMER FOR VIBRATION-DAMPING MATERIAL | KANEKA CORP (JP) | 2016-11-16 | — | — | EP | disclosed |
| US-20060247376-A1 | Curing composition | KANEKA CORPORATION (JP) | 2006-11-02 | — | — | US | disclosed |
| US-20060079645-A1 | Curable compositions | KANEKA CORPORATION (JP) | 2006-04-13 | — | — | US | disclosed |
| EP-1642932-A1 | CURING COMPOSITION | KANEKA CORPORATION (JP) | 2006-04-05 | — | — | EP | disclosed |
| EP-1637565-A1 | CURING COMPOSITION | KANEKA CORPORATION (JP) | 2006-03-22 | — | — | EP | disclosed |
| EP-1630186-A1 | CURING COMPOSITION | Kaneka Corporation (JP) | 2006-03-01 | — | — | EP | disclosed |
| EP-1598402-A1 | CURABLE COMPOSITIONS | KANEKA CORPORATION (JP) | 2005-11-23 | — | — | EP | disclosed |
| EP-1406932-A4 | QUICK CURING COMPOSITION | KANEKA CORP (JP) | 2005-03-23 | — | — | EP | disclosed |
| US-20040210019-A1 | Quick curing compositions | KANEKA CORPORATION (JP) | 2004-10-21 | — | — | US | disclosed |
| EP-1406932-A1 | QUICK CURING COMPOSITION | KANEKA CORPORATION (JP) | 2004-04-14 | — | — | EP | disclosed |
| WO-2003000749-A1 | QUICK CURING COMPOSITION | KANEKA CORPORATION (JP) | 2003-01-03 | — | — | WO | disclosed |