SCHEMBL7555907

SCHEMBL7555907

Cc1cc(Cc2ccc(C)c(N)c2C)cc(C)c1N

nearest known ligand 0.47

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
POLB P06746 2/20 0.43
ALDH1A1 P00352 3/20 0.38
TDP1 Q9NUW8 2/20 0.38
TP53 P04637 1/20 0.38
CYP3A4 P08684 1/20 0.38
TSHR P16473 1/20 0.38
KDM4E B2RXH2 1/20 0.36
LMNA P02545 1/20 0.36
GAA P10253 1/20 0.36
HPGD P15428 1/20 0.36
HSD17B10 Q99714 1/20 0.36
ESR1 P03372 1/20 0.35
ESR2 Q92731 1/20 0.35
CD44 P16070 1/20 0.34
TAAR1 Q96RJ0 1/20 0.33
DHFR P00374 1/20 0.33
ATP4A P20648 1/20 0.33
ATP4B P51164 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1259716 0.83 POLB (0.54) POLBALDH1A1TDP1TSHRKDM4E
SCHEMBL20960652 0.80 ALDH1A1 (0.41) POLBALDH1A1TDP1TP53CYP3A4
SCHEMBL15015630 0.78 MAPT (0.42) POLBALDH1A1TP53CYP3A4LMNA
SCHEMBL307367 0.76 ALDH1A1 (0.55) POLBALDH1A1TDP1TP53CYP3A4
SCHEMBL12607301 0.74 ALDH1A1 (0.48) POLBALDH1A1TDP1TP53CYP3A4
Ammonia Solution, Strong SCHEMBL3031871 0.74 ALDH1A1 (0.52) POLBALDH1A1TDP1TP53CYP3A4
SCHEMBL10799481 0.73 CYP3A4 (0.45) ALDH1A1TDP1TP53CYP3A4TSHR
SCHEMBL11661917 0.73 POLB (0.52) POLBALDH1A1CYP3A4TSHRKDM4E
SCHEMBL10946904 0.73 POLB (0.52) POLBALDH1A1TDP1KDM4ELMNA
SCHEMBL8371085 0.72 ALDH1A1 (0.41) POLBALDH1A1TDP1TP53CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6473288-B2 Adhesive sheet and electrostatic chucking device TOMOEGAWA PAPER CO. (JP) 2002-10-29 US disclosed
US-6395391-B1 MULTILAYER; METAL SUBSTRATE, ADHESIVE LAYERS TOMOEGAWA PAPER CO., LTD. (JP) 2002-05-28 US disclosed
US-20020004134-A1 Adhesive sheet and electrostatic chucking device TOMOEGAWA PAPER CO., LTD. 2002-01-10 US disclosed
US-6268033-B1 POLYIMIDE TOMOEGAWA PAPER CO., LTD. (JP) 2001-07-31 US disclosed
US-6265042-B1 POLYIMIDE TOMOEGAWA PAPER CO., LTD. (JP) 2001-07-24 US disclosed
US-6228452-B1 POLYIMIDE ON METAL SUBSTRATE TOMOEGAWA PAPER CO., LTD. (JP) 2001-05-08 US disclosed
US-6132865-A METAL SUBSTRATE AND ADHESIVE LAYERS TOMOEGAWA PAPER CO., LTD. (JP) 2000-10-17 US disclosed
US-6045886-A TWO ADHESIVE LAYERS ARE RESIN LAYERS COMPOSED OF 100-40% BY MOL OF A POLYIMIDE; SAID TWO ADHESIVE LAYERS HAVING EACH A DIFFERENT GLASS TRANSITION TEMPERATURE; HEAT RESISTANCE TOMOEGAWA PAPER CO., LTD. (JP) 2000-04-04 US disclosed
US-5891540-A POLYIMIDE TOMOEGAWA PAPER CO., LTD. (JP) 1999-04-06 US disclosed