SCHEMBL7572989

SCHEMBL7572989

Cc1cccc(N=C=O)c1CN=C=O

nearest known ligand 0.55

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
CYP3A4 P08684 3/20 0.55
TRPA1 O75762 1/20 0.41
GABRA1 P14867 1/20 0.39
GABRB2 P47870 1/20 0.39
ALDH1A1 P00352 1/20 0.32
HPGD P15428 1/20 0.32
TDP1 Q9NUW8 1/20 0.32
TAAR1 Q96RJ0 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11856318 0.89 CYP3A4 (0.57) CYP3A4TRPA1GABRA1GABRB2ALDH1A1
SCHEMBL3922806 0.85 CYP3A4 (0.40) CYP3A4TRPA1GABRA1GABRB2ALDH1A1
SCHEMBL4705523 0.84 CYP3A4 (0.57) CYP3A4TRPA1GABRA1GABRB2ALDH1A1
SCHEMBL10964195 0.83 GABRA1 (0.53) CYP3A4TRPA1GABRA1GABRB2ALDH1A1
SCHEMBL6377899 0.82 CYP3A4 (0.55) CYP3A4TRPA1GABRA1GABRB2ALDH1A1
SCHEMBL4887211 0.81 CYP3A4 (0.46) CYP3A4TRPA1GABRA1GABRB2
SCHEMBL29575652 0.81 CYP3A4 (0.53) CYP3A4TRPA1GABRA1GABRB2ALDH1A1
SCHEMBL15352625 0.81 CYP3A4 (0.53) CYP3A4TRPA1GABRA1GABRB2ALDH1A1
SCHEMBL10966479 0.80 CYP3A4 (0.49) CYP3A4TRPA1GABRA1GABRB2HPGD
SCHEMBL10968554 0.79 CYP3A4 (0.47) CYP3A4TRPA1GABRA1GABRB2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 554 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-121574342-A Benzenedimethylene diisocyanate composition, preparation method and application thereof 万华化学集团股份有限公司 2026-02-27 CN claimed
CN-116239755-B Polyisocyanate composition with high reactivity and preparation method thereof 万华化学集团股份有限公司 2025-05-13 CN claimed
CN-119822999-A Benzenedimethylene diisocyanate composition, preparation method and application thereof 万华化学集团股份有限公司 2025-04-15 CN claimed
CN-119529216-A Tear-resistant functional chain extender, preparation and application thereof in tear-resistant polyurethane 广州秀珀化工涂料有限公司 2025-02-28 CN claimed
CN-119463109-A Bio-based polyurethane composite resin composition 万华化学集团股份有限公司 2025-02-18 CN claimed
CN-114423736-B Method for distilling isocyanates 科思创德国股份有限公司 2025-02-18 CN claimed
CN-114945646-B Adhesive composition, adhesive sheet, and double-sided adhesive sheet 三菱化学株式会社 2024-12-24 CN claimed
CN-118290702-A Polyisocyanate composition and preparation method thereof 万华化学(宁波)有限公司 2024-07-05 CN claimed
CN-118265735-A Electrodeposition coating composition and preparation thereof 巴斯夫涂料有限公司 2024-06-28 CN claimed
CN-117695431-A Embolic microsphere loaded with radiotherapy nuclide and preparation method thereof 无锡市南京大学锡山应用生物技术研究所 2024-03-15 CN claimed
CN-114630868-A Isocyanate-based foam and process for producing the same 普罗普里特公司 2022-06-14 CN claimed
CN-114507332-A Polyisocyanate containing biuret structure and preparation method thereof 万华化学(宁波)有限公司 2022-05-17 CN claimed
CN-109642075-B Foamed isocyanate-based polymers 普罗普里特公司 2022-04-29 CN claimed
CN-114144447-A Poly (arylene ether) composition 高新特殊工程塑料全球技术有限公司 2022-03-04 CN claimed
CN-113980238-A Xylylene diisocyanate composition and preparation method and application thereof 万华化学集团股份有限公司 2022-01-28 CN claimed
WO-2019046679-A1 METHOD FOR DEBLOCKING A BLOCKED ISOCYANATE AND METHOD OF MAKING A POLYURETHANE THE UNIVERSITY OF MASSACHUSETTS (US) 2019-03-07 WO claimed
EP-2744834-A1 POLYMERS COMPRISING PHOTOINITIATOR MOIETIES AND DYE MOIETIES Lambson Limited (GB) 2014-06-25 EP claimed
CN-101107340-B Composition for heat-storage object formation, heat-storage object, and process for producing heat-storage object SK KAKEN CO LTD 2013-07-03 CN claimed
WO-2013026451-A1 POLYMERS COMPRISING PHOTOINITIATOR MOIETIES AND DYE MOIETIES COLOPLAST A/S (DK) 2013-02-28 WO claimed
CN-101309944-B Thermosetting resin composition, thermosetting resin composition solution, film forming material and their cured product SHOWA DENKO KABUSHIKI KAISHA (JP) 2012-02-15 CN claimed