SCHEMBL7589637

SCHEMBL7589637

[Cu].[Hf].[Ni].[Ti]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25263 0.87
SCHEMBL29280663 0.87
SCHEMBL29203047 0.87
SCHEMBL578578 0.87
SCHEMBL23356144 0.75
SCHEMBL18831156 0.75
SCHEMBL17838073 0.75
SCHEMBL4735435 0.75
SCHEMBL453865 0.75
SCHEMBL5705462 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20020189719-A1 Fabrication of high temperature low hysterisis shape memory alloy thin film DELPHI TECHNOLOGIES, INC. 2002-12-19 US claimed
US-20250336764-A1 PASSIVE THERMAL CONTROL LAYER FOR INTEGRATED DEVICE TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2025-10-30 US disclosed
US-20250167074-A1 PASSIVE THERMAL CONTROL LAYER FOR INTEGRATED DEVICE TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2025-05-22 US disclosed
CN-119601548-A Integrated device and method of forming the same 台湾积体电路制造股份有限公司 2025-03-11 CN disclosed
US-20020189719-A1 Fabrication of high temperature low hysterisis shape memory alloy thin film DELPHI TECHNOLOGIES, INC. 2002-12-19 US disclosed
US-20020189719-A1 Fabrication of high temperature low hysterisis shape memory alloy thin film DELPHI TECHNOLOGIES, INC. 2002-12-19 US disclosed