SCHEMBL759055

SCHEMBL759055

CC=CCOCCC[Si](OC)(OC)OC

nearest known ligand 0.32

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
LMNA P02545 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7093018 1.00 LMNA (0.32) LMNA
SCHEMBL728876 0.87
SCHEMBL728877 0.87
SCHEMBL28176066 0.82
SCHEMBL9001402 0.81
SCHEMBL28969560 0.79
SCHEMBL298549 0.78 LMNA (0.40) LMNA
SCHEMBL961357 0.78 MEN1 (0.39) LMNA
SCHEMBL3241237 0.75 LSS (0.32)
SCHEMBL12301854 0.75 LMNA (0.39) LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109476964-B Polymeric binder layer as a ceramic precursor 3M创新有限公司 2022-04-26 CN disclosed
US-9274419-B2 Blue photosensitive resin composition for color filter and application thereof CHI MEI CORPORATION (TW) 2016-03-01 US disclosed
US-9268218-B2 Photosensitive resin composition for color filter and application thereof CHI MEI CORPORATION (TW) 2016-02-23 US disclosed
US-20150323863-A1 PHOTOSENSITIVE RESIN COMPOSITION FOR COLOR FILTER AND APPLICATION THEREOF CHI MEI CORPORATION (TW) 2015-11-12 US disclosed
US-20150268554-A1 BLUE PHOTOSENSITIVE RESIN COMPOSITION FOR COLOR FILTER AND APPLICATION THEREOF CHI MEI CORPORATION (TW) 2015-09-24 US disclosed
US-9063419-B2 Photo-curing polysiloxane composition and application thereof CHI MEI CORPORATION (TW) 2015-06-23 US disclosed
US-8921024-B2 Photosensitive polysiloxane composition and applications thereof CHI MEI CORPORATION (TW) 2014-12-30 US disclosed
US-20140178819-A1 PHOTOSENSITIVE POLYSILOXANE COMPOSITION AND APPLICATIONS THEREOF CHI MEI CORPORATION (TW) 2014-06-26 US disclosed
US-20130310497-A1 PHOTO-CURING POLYSILOXANE COMPOSITION AND APPLICATIONS THEREOF CHI MEI CORPORATION (TW) 2013-11-21 US disclosed
US-20130280541-A1 PHOTO-CURING POLYSILOXANE COMPOSITION AND APPLICATION THEREOF CHI MEI CORPORATION (TW) 2013-10-24 US disclosed
US-20120052439-A1 PHOTO-CURING POLYSILOXANE COMPOSITION AND PROTECTIVE FILM FORMED FROM THE SAME CHI MEI CORPORATION (TW) 2012-03-01 US disclosed
EP-0953585-B1 Modified polyisocyanate and production process thereof MITSUI TAKEDA CHEMICALS INC (JP) 2003-07-16 EP disclosed
US-6515043-B2 Surface treatment of filler CROMPTON CORPORATION 2003-02-04 US disclosed
US-6395856-B1 CURABLE POLYSILOXANES FOR PROTECTIVE COATINGS FOR WIRES CROMPTON CORPORATION 2002-05-28 US disclosed
US-20010021761-A1 Silicone oligomers with heigher alkoxy groups MOMENTIVE PERFORMANCE MATERIALS INC. 2001-09-13 US disclosed
US-6221995-B1 USED AS CURING AGENT FOR AQUEOUS RESIN COMPOSITIONS E.G., PAINTS, PRINTING INKS AND ADHESIVES TAKEDA CHEMICAL INDUSTRIES, LTD. (JP) 2001-04-24 US disclosed
US-6207783-B1 UNDERGROUND INSULATION CROMPTON CORPORATION 2001-03-27 US disclosed
EP-0991698-A1 SILICONE OLIGOMERS AND CURABLE COMPOSITIONS CONTAINING SAME CK WITCO CORPORATION (US) 2000-04-12 EP disclosed
EP-0953585-A1 Modified polyisocyanate and production process thereof Takeda Chemical Industries, Ltd. (JP) 1999-11-03 EP disclosed
WO-1999054386-A1 SILICONE OLIGOMERS AND CURABLE COMPOSITIONS CONTAINING SAME WITCO CORPORATION (US) 1999-10-28 WO disclosed