⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8415361 | 0.72 | — | — | |
| SCHEMBL1286113 | 0.67 | — | — | |
| SCHEMBL21049673 | 0.67 | ALDH1A1 (0.36) | — | |
| SCHEMBL474807 | 0.67 | ALDH1A1 (0.36) | — | |
| SCHEMBL184295 | 0.65 | — | — | |
| SCHEMBL706367 | 0.64 | — | — | |
| SCHEMBL9147129 | 0.62 | — | — | |
| SCHEMBL6380568 | 0.61 | — | — | |
| SCHEMBL1900614 | 0.61 | — | — | |
| SCHEMBL1394215 | 0.61 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 184 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3495373-B1 | HYDROCARBYLOXYDISILANES | DOW SILICONES CORP (US) | 2021-01-20 | — | — | EP | claimed |
| CN-110105383-A | Oxyl disilane | 美国陶氏有机硅公司 | 2019-08-09 | — | — | CN | claimed |
| US-4599393-A | Method for polymerizing lactams and products obtained therefrom | GENERAL ELECTRIC COMPANY (US) | 1986-07-08 | — | — | US | claimed |
| US-20260150635-A1 | INHIBITED ATOMIC LAYER DEPOSITION FOR PATTERNING APPLICATIONS | LAM RESEARCH CORPORATION (US) | 2026-05-28 | — | — | US | disclosed |
| CN-113921459-B | Semiconductor element and method for manufacturing the same | 南亚科技股份有限公司 | 2026-05-15 | — | — | CN | disclosed |
| CN-114388433-B | Semiconductor device and method for manufacturing the same | 南亚科技股份有限公司 | 2026-05-15 | — | — | CN | disclosed |
| CN-122029303-A | Seamless gap filling by suppressed atomic layer deposition | 朗姆研究公司 | 2026-05-12 | — | — | CN | disclosed |
| US-12622232-B2 | Advanced self aligned multiple patterning using tin oxide | LAM RESEARCH CORPORATION (US) | 2026-05-05 | — | — | US | disclosed |
| US-20260098333-A1 | INHIBITED OXIDE DEPOSITION FOR REFILLING SHALLOW TRENCH ISOLATION | LAM RES CORP (US) | 2026-04-09 | — | — | US | disclosed |
| US-12598930-B2 | Conformal thermal CVD with controlled film properties and high deposition rate | LAM RESEARCH CORPORATION (US) | 2026-04-07 | — | — | US | disclosed |
| US-20260090294-A1 | DOPED SILICON OR BORON LAYER FORMATION | LAM RES CORP (US) | 2026-03-26 | — | — | US | disclosed |
| US-20150044882-A1 | FLOWABLE OXIDE FILM WITH TUNABLE WET ETCH RATE | NOVELLUS SYSTEMS INC (US) | 2015-02-12 | — | — | US | disclosed |
| US-20150004806-A1 | LOW-K OXIDE DEPOSITION BY HYDROLYSIS AND CONDENSATION | LAM RESEARCH CORPORATION | 2015-01-01 | — | — | US | disclosed |
| US-8846536-B2 | Flowable oxide film with tunable wet etch rate | NOVELLUS SYSTEMS, INC. (US) | 2014-09-30 | — | — | US | disclosed |
| US-20130230987-A1 | FLOWABLE OXIDE FILM WITH TUNABLE WET ETCH RATE | NOVELLUS SYSTEMS, INC. | 2013-09-05 | — | — | US | disclosed |
| CN-102569165-A | Bottom up fill in high aspect ratio trenches | NOVELLUS SYSTEMS INC | 2012-07-11 | — | — | CN | disclosed |
| US-20120161405-A1 | SYSTEM AND APPARATUS FOR FLOWABLE DEPOSITION IN SEMICONDUCTOR FABRICATION | NOVELLUS SYSTEMS, INC. | 2012-06-28 | — | — | US | disclosed |
| US-20120149213-A1 | BOTTOM UP FILL IN HIGH ASPECT RATIO TRENCHES | NOVELLUS SYSTEMS, INC. | 2012-06-14 | — | — | US | disclosed |
| US-20020158310-A1 | Insulating film of semiconductor device and coating solution for forming insulating film and method of manufacturing insulating film | KAWASAKI STEEL CORPORATION (JP) | 2002-10-31 | — | — | US | disclosed |
| EP-0686680-A1 | ISOLATION FILM OF SEMICONDUCTOR DEVICE, COATING FLUID FOR FORMING THE FILM, AND PROCESS FOR PRODUCING THE FILM | KAWASAKI STEEL CORPORATION (JP) | 1995-12-13 | — | — | EP | disclosed |