SCHEMBL7602206

SCHEMBL7602206

O=C=Nc1ccc(OCCCCCOc2ccc(N=C=O)cc2)cc1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.50
CYP3A4 P08684 1/20 0.50
FURIN P09958 1/20 0.44
GAA P10253 1/20 0.44
KCNA3 P22001 1/20 0.41
L3MBTL1 Q9Y468 1/20 0.41
PRMT1 Q99873 3/20 0.40
F2 P00734 2/20 0.40
ST14 Q9Y5Y6 2/20 0.40
PLAU P00749 1/20 0.40
PRMT5 O14744 1/20 0.40
NR5A1 Q13285 1/20 0.40
SLC22A2 O15244 1/20 0.40
SLC22A1 O15245 1/20 0.40
TMPRSS2 O15393 1/20 0.40
PTP4A3 O75365 1/20 0.40
SLC22A3 O75751 1/20 0.40
F10 P00742 1/20 0.40
PLG P00747 1/20 0.40
S100B P04271 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10703892 1.00 TSHR (0.50) TSHRCYP3A4FURINGAAKCNA3
SCHEMBL10341873 0.98 CYP3A4 (0.52) TSHRCYP3A4FURINGAAKCNA3
SCHEMBL1493053 0.94 CYP3A4 (0.52) TSHRCYP3A4FURINGAAKCNA3
SCHEMBL10341829 0.92 CYP3A4 (0.54) TSHRCYP3A4FURINKCNA3L3MBTL1
SCHEMBL7777016 0.91 NR5A1 (0.54) TSHRGAANR5A1TP53PLA2G4B
SCHEMBL1020538 0.91 NR5A1 (0.54) TSHRGAANR5A1TP53PLA2G4B
SCHEMBL11848774 0.91 NR5A1 (0.54) TSHRGAANR5A1TP53PLA2G4B
SCHEMBL3707532 0.91 NR5A1 (0.54) TSHRGAANR5A1TP53PLA2G4B
SCHEMBL9702597 0.91 NR5A1 (0.54) TSHRGAANR5A1TP53PLA2G4B
SCHEMBL9162002 0.91 NR5A1 (0.54) TSHRGAANR5A1TP53PLA2G4B

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6492484-B2 FLEXIBLE ADHESIVE FILM/POLYURETHANE UNDERFILLING FOR DIE BONDING OF A SEMICONDUCTOR CHIP TO AN ELECTRODE NITTO DENKO CORPORATION (JP) 2002-12-10 US disclosed
US-20020055606-A1 Flexible adhesive film/polyurethane underfilling for die bonding of a semiconductor chip to an electrode NITTO DENKO CORPORATION (JP) 2002-05-09 US disclosed