SCHEMBL760340

SCHEMBL760340

CCO[Si](CC)(CC)O[Si](CC)(CC)OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10798099 0.97
SCHEMBL103891 0.86
SCHEMBL9863284 0.85
SCHEMBL1482800 0.83
Ammonia Solution, Strong SCHEMBL8004370 0.83
SCHEMBL16807004 0.81
SCHEMBL703185 0.80
SCHEMBL703874 0.80
SCHEMBL21373919 0.78
SCHEMBL1143237 0.78

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 215 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20210066075-A1 STRUCTURES INCLUDING DIELECTRIC LAYERS AND METHODS OF FORMING SAME ASM IP HOLDING B.V. (NL) 2021-03-04 US claimed
US-11822243-B2 Negative-type photosensitive resin composition, cured film, element and display device provided with cured film, and production method therefor TORAY INDUSTRIES, INC. (JP) 2023-11-21 US disclosed
CN-109062007-B Positive photosensitive polysiloxane composition and application thereof 奇美实业股份有限公司 2023-03-10 CN disclosed
CN-107885034-B Negative white photosensitive resin composition and application thereof 奇美实业股份有限公司 2023-03-07 CN disclosed
CN-108693710-B Positive photosensitive polysiloxane composition 奇美实业股份有限公司 2022-12-02 CN disclosed
CN-109804310-B Negative photosensitive resin composition, cured film, element and display device provided with cured film, and method for producing same 东丽株式会社 2022-09-30 CN disclosed
CN-114460809-A Negative photosensitive resin composition, cured film, display device provided with cured film, and method for producing same 东丽株式会社 2022-05-10 CN disclosed
CN-108885399-B Negative photosensitive resin composition, cured film, display device provided with cured film, and method for producing same 东丽株式会社 2022-03-15 CN disclosed
CN-107179652-B Positive photosensitive polysiloxane composition and application thereof 奇美实业股份有限公司 2022-02-08 CN disclosed
CN-108604062-B Negative photosensitive resin composition, cured film, display device having cured film, and method for producing same 东丽株式会社 2021-11-09 CN disclosed
US-20010055892-A1 Composition for film formation, process for producing composition for film formation, method of film formation, and silica-based film JSR CORPORATION (JP) 2001-12-27 US disclosed
US-20010051446-A1 Method of manufacturing insulating film-forming material, the insulating film-forming material, and insulating film JSR CORPORATION (JP) 2001-12-13 US disclosed
EP-1160848-A2 Composition for silica-based film formation JSR Corporation (JP) 2001-12-05 EP disclosed
EP-1148105-A2 Composition for film formation, method of film formation, and silica-based film JSR Corporation (JP) 2001-10-24 EP disclosed
EP-1146092-A2 Composition for film formation, method of film formation, and silica-based film JSR Corporation (JP) 2001-10-17 EP disclosed
EP-1127929-A2 Composition for film formation, method of film formation, and silica-based film JSR Corporation (JP) 2001-08-29 EP disclosed
EP-1090967-A2 Composition for film formation, method of film formation, and insulating film JSR Corporation (JP) 2001-04-11 EP disclosed
EP-1088868-A2 Composition for film formation, method of film formation, and insulating film JSR Corporation (JP) 2001-04-04 EP disclosed
EP-0497102-A2 Vanadium and magnesium containing component for a Ziegler-Natta catalytic system BASF Aktiengesellschaft (DE) 1992-08-05 EP disclosed
US-4678468-A HEPARIN IN INTERPENETRATING POLYMER NETWORK BIO-MEDICAL CO., LTD. (JP) 1987-07-07 US disclosed