SCHEMBL7606736

SCHEMBL7606736

Oc1ccc(-c2ccc(C3CO3)cc2)cc1.c1ccc(-c2ccc(C3CO3)cc2)cc1

nearest known ligand 0.59

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
▸ TSHR P16473 1/20 0.59
▸ MMP3 P08254 1/20 0.58
▸ BCL2L1 Q07817 1/20 0.58
▸ CHRM2 P08172 2/20 0.53
▸ KDM1A O60341 3/20 0.44
▸ ESR1 P03372 3/20 0.43
▸ MEN1 O00255 3/20 0.43
▸ KMT2A Q03164 3/20 0.43
▸ ESR2 Q92731 2/20 0.42
▸ MAPT P10636 2/20 0.41
▸ RAB9A P51151 2/20 0.41
▸ NPC1 O15118 1/20 0.41
▸ CYP3A4 P08684 1/20 0.41
▸ ADORA3 P0DMS8 1/20 0.41
▸ MAPK1 P28482 1/20 0.41
▸ MAOB P27338 1/20 0.41
▸ LMNA P02545 1/20 0.41
▸ TAAR1 Q96RJ0 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Phenol SCHEMBL2208770 0.90 TSHR (0.67) TSHRMMP3BCL2L1CHRM2ESR2
SCHEMBL675866 0.90 TSHR (0.73) TSHRCHRM2KDM1AMAOBTAAR1
SCHEMBL10300819 0.90 TSHR (0.73) TSHRCHRM2KDM1AMAOBTAAR1
SCHEMBL2063957 0.85 TSHR (0.56) TSHRKDM1AESR1MEN1KMT2A
SCHEMBL2063039 0.85 TSHR (0.56) TSHRKDM1AESR1MEN1KMT2A
Biphenyl SCHEMBL8064797 0.83 TSHR (0.85) TSHRCHRM2MEN1KMT2A
SCHEMBL867412 0.81 TSHR (0.62) TSHRCHRM2TAAR1
SCHEMBL10070384 0.79 TSHR (0.57) TSHRCHRM2KDM1AMEN1KMT2A
SCHEMBL279278 0.79 TSHR (0.57) TSHRCHRM2KDM1AMEN1KMT2A
Hydrogen Peroxide SCHEMBL28927927 0.79 TSHR (0.94) TSHRCHRM2MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20020151659-A1 Formed from 6,6'-bis(2-(4-fluorophenyl)-4- phenylquinoline) and 4,4'-(1,1,1,3,3,3-hexafluoro-2,2-propylidene)bisphenol and 2,2-bis((4-maleimidophenoxy)phenyl)propane; dielectrics HITACHI CHEMICAL CO., LTD. (JP) 2002-10-17 — — US disclosed
US-6462148-B1 RESIN COMPOSITION COMPRISING A POLYMER CONTAINING A QUINOLINE RING AND A THERMOSETTING RESIN, AN INSULATING MATERIAL CONSTITUTED BY SAID RESIN COMPOSITION AND AN ADHESIVE FILM, PARTICULARLY A RESIN FOR AN INTERLAYER INSULATION FILM HITACHI CHEMICAL CO., LTD. (JP) 2002-10-08 — — US disclosed
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