⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27790644 | 0.87 | — | — | |
| SCHEMBL28191802 | 0.87 | — | — | |
| SCHEMBL14635769 | 0.82 | — | — | |
| SCHEMBL23512 | 0.82 | — | — | |
| SCHEMBL27802619 | 0.82 | — | — | |
| SCHEMBL310479 | 0.82 | — | — | |
| SCHEMBL11882689 | 0.82 | — | — | |
| SCHEMBL1241039 | 0.82 | — | — | |
| SCHEMBL1241038 | 0.82 | — | — | |
| SCHEMBL27348066 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-111068665-B | Selective hydrogenation catalyst and preparation method thereof | 中国石油化工股份有限公司 | 2023-08-11 | — | — | CN | disclosed |
| CN-111068665-A | Selective hydrogenation catalyst and preparation method thereof | 中国石油化工股份有限公司 | 2020-04-28 | — | — | CN | disclosed |
| CN-107574348-B | A kind of method that rapid solidification method prepares silumin | 泸溪县群祥新材料有限责任公司 | 2018-12-25 | — | — | CN | disclosed |
| CN-107574348-A | A kind of method that rapid solidification method prepares silumin | 泸溪县群祥新材料有限责任公司 | 2018-01-12 | — | — | CN | disclosed |
| US-20020089027-A1 | Apparatus for filling apertures in a film layer on a semiconductor structure | XU ZHENG (US) | 2002-07-11 | — | — | US | disclosed |
| US-6313027-B1 | Method for low thermal budget metal filling and planarization of contacts vias and trenches | APPLIED MATERIALS, INC. | 2001-11-06 | — | — | US | disclosed |
| US-6217721-B1 | FILLING PLUG HAVING HIGH ASPECT RATIO BY PRECOATING INTERIOR OF PLUG HOLE OR OTHER APERTURE WITH LINER LAYER DEPOSITED BY PHYSICAL VAPOR DEPOSITION UTILIZING HIGH-DENSITY PLASMA | APPLIED MATERIALS, INC. | 2001-04-17 | — | — | US | disclosed |
| US-6136095-A | Apparatus for filling apertures in a film layer on a semiconductor substrate | APPLIED MATERIALS, INC. (US) | 2000-10-24 | — | — | US | disclosed |
| US-5962923-A | IN A MULTILAYER INTEGRATED CIRCUIT | APPLIED MATERIALS, INC. (US) | 1999-10-05 | — | — | US | disclosed |
| EP-0799903-A2 | Methods of sputtering a metal onto a substrate and semiconductor processing apparatus | APPLIED MATERIALS, INC. (US) | 1997-10-08 | — | — | EP | disclosed |
| EP-0758148-A2 | Method and apparatus for forming electrical contacts in multi-layer integrated circuits | APPLIED MATERIALS, INC. (US) | 1997-02-12 | — | — | EP | disclosed |