SCHEMBL761935

SCHEMBL761935

O=C(C=CC1CCCCC1)C=CC1CCCCC1

nearest known ligand 0.43

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
CES2 O00748 1/20 0.38
CES1 P23141 1/20 0.38
GRIN1 Q05586 1/20 0.36
GRIN2B Q13224 1/20 0.36
NPC1 O15118 3/20 0.34
SMN1; SMN2 Q16637 3/20 0.34
HTT P42858 1/20 0.34
GAA P10253 1/20 0.34
PADI4 Q9UM07 1/20 0.34
EPHX1 P07099 5/20 0.33
RAB9A P51151 2/20 0.33
MAPT P10636 1/20 0.33
KDM4E B2RXH2 1/20 0.33
ALDH1A1 P00352 1/20 0.33
CYP3A4 P08684 1/20 0.33
EPHX2 P34913 1/20 0.33
GRIK1 P39086 1/20 0.32
HDAC8 Q9BY41 1/20 0.32
HDAC6 Q9UBN7 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17263955 0.82 HTT (0.47) CES2CES1GRIN1GRIN2BNPC1
SCHEMBL10698184 0.82 CES2 (0.36) CES2CES1GRIN1GRIN2BNPC1
SCHEMBL221714 0.82 HTT (0.47) CES2CES1GRIN1GRIN2BNPC1
SCHEMBL11845850 0.82 HTT (0.47) CES2CES1GRIN1GRIN2BNPC1
SCHEMBL4599663 0.82 HTT (0.47) CES2CES1GRIN1GRIN2BNPC1
SCHEMBL23749603 0.82 HTT (0.47) CES2CES1GRIN1GRIN2BNPC1
SCHEMBL9063561 0.82 HTT (0.47) CES2CES1GRIN1GRIN2BNPC1
SCHEMBL9743609 0.82 HTT (0.47) CES2CES1GRIN1GRIN2BNPC1
SCHEMBL15290579 0.82 HTT (0.47) CES2CES1GRIN1GRIN2BNPC1
SCHEMBL1151110 0.82 HTT (0.47) CES2CES1GRIN1GRIN2BNPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024060641-A1 CYCLOTRIARYLPHOSPHINE, METHOD FOR PREPARING SAME, AND USE THEREOF 东莞市均成高新材料有限公司 2024-03-28 WO disclosed
CN-115850329-A Cycloterpyriaryl phosphines, their preparation and use 东莞市均成高新材料有限公司 2023-03-28 CN disclosed
US-8815472-B2 Volume hologram optical recording medium, composition for volume hologram recording layer formation, and volume hologram recording material MITSUBISHI CHEMICAL CORPORATION (JP) 2014-08-26 US disclosed
EP-2077471-B1 VOLUME HOLOGRAM OPTICAL RECORDING MEDIUM, COMPOSITION FOR VOLUME HOLOGRAM RECORDING LAYER FORMATION, AND VOLUME HOLOGRAM RECORDING MATERIAL MITSUBISHI CHEM CORP (JP) 2012-07-25 EP disclosed
EP-2063324-B1 VOLUME HOLOGRAM OPTICAL RECORDING MEDIUM, COMPOSITION FOR FORMING VOLUME HOLOGRAM RECORDING LAYER, VOLUME HOLOGRAM RECORDING MATERIAL, AND VOLUME HOLOGRAM OPTICAL RECORDING METHOD MITSUBISHI CHEM CORP (JP) 2012-03-21 EP disclosed
US-20100067073-A1 VOLUME HOLOGRAM OPTICAL RECORDING MEDIUM, COMPOSITION FOR VOLUME HOLOGRAM RECORDING LAYER FORMATION, AND VOLUME HOLOGRAM RECORDING MATERIAL MITSUBISHI CHEMICAL CORPORATION (JP) 2010-03-18 US disclosed
US-20100039685-A1 VOLUME HOLOGRAM OPTICAL RECORDING MEDIUM, COMPOSITION FOR FORMING VOLUME HOLOGRAM RECORDING LAYER, VOLUME HOLOGRAM RECORDING MATERIAL, AND VOLUME HOLOGRAM OPTICAL RECORDING METHOD MITSUBISHI CHEMICAL CORPORATION (JP) 2010-02-18 US disclosed
EP-2077471-A1 VOLUME HOLOGRAM OPTICAL RECORDING MEDIUM, COMPOSITION FOR VOLUME HOLOGRAM RECORDING LAYER FORMATION, AND VOLUME HOLOGRAM RECORDING MATERIAL Mitsubishi Chemical Corporation (JP) 2009-07-08 EP disclosed
EP-2063324-A1 VOLUME HOLOGRAM OPTICAL RECORDING MEDIUM, COMPOSITION FOR FORMING VOLUME HOLOGRAM RECORDING LAYER, VOLUME HOLOGRAM RECORDING MATERIAL, AND VOLUME HOLOGRAM OPTICAL RECORDING METHOD Mitsubishi Chemical Corporation (JP) 2009-05-27 EP disclosed
EP-1146083-B1 USE OF A RESIN MATERIAL FOR ELECTRICAL INSULATING AND ELECTRIC WIRE AND CABLE USING THE SAME JAPAN POLYOLEFINS CO LTD (JP) 2005-01-05 EP disclosed
US-6479590-B1 Electrical insulating resin material, electrical insulating material, and electric wire and cable using the same JAPAN POLYOLEFINS CO., LTD. (JP) 2002-11-12 US disclosed
EP-1146083-A1 ELECTRICAL INSULATING RESIN MATERIAL, ELECTRICAL INSULATING MATERIAL, AND ELECTRIC WIRE AND CABLE USING THE SAME Japan Polyolefins Co., Ltd. (JP) 2001-10-17 EP disclosed