Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TP53 | P04637 | 1/20 | 0.36 |
| ▸ | PSIP1 | O75475 | 1/20 | 0.31 |
| ▸ | IDO1 | P14902 | 1/20 | 0.31 |
| ▸ | LMNA | P02545 | 1/20 | 0.30 |
| ▸ | ATM | Q13315 | 1/20 | 0.30 |
| ▸ | TAAR1 | Q96RJ0 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Methoxymethane SCHEMBL7621929 | 0.78 | TSHR (0.35) | TP53LMNA | |
| Potassium Ion SCHEMBL135041 | 0.78 | ALDH1A1 (0.40) | LMNA | |
| SCHEMBL689950 | 0.78 | ALDH1A1 (0.40) | LMNA | |
| SCHEMBL298292 | 0.75 | TP53 (0.36) | TP53PSIP1LMNAATMTAAR1 | |
| SCHEMBL137469 | 0.74 | ALDH1A1 (0.38) | LMNA | |
| Lithium Ion SCHEMBL132837 | 0.74 | ALDH1A1 (0.38) | LMNA | |
| Trimethylammonium SCHEMBL297595 | 0.73 | TSHR (0.35) | TP53LMNA | |
| SCHEMBL297115 | 0.73 | TSHR (0.35) | TP53LMNA | |
| Ether SCHEMBL7624731 | 0.70 | TP53 (0.36) | TP53PSIP1IDO1LMNAATM | |
| Diethylaniline SCHEMBL297015 | 0.70 | TP53 (0.32) | TP53 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0755971-B1 | Molding resin, composition containing the same, and processes for producing them | TOSOH CORP (JP) | 2002-03-06 | — | — | EP | disclosed |
| US-5962599-A | ETHYLENE-HEXENE COPOLYMER | TOSOH CORPORATION (JP) | 1999-10-05 | — | — | US | disclosed |
| EP-0755971-A2 | Molding resin, composition containing the same, and processes for producing them | Tosoh Corporation (JP) | 1997-01-29 | — | — | EP | disclosed |