⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8503587 | 0.74 | — | — | |
| Butadiene Epoxide SCHEMBL335040 | 0.72 | — | — | |
| Butadiene Epoxide SCHEMBL39877 | 0.72 | — | — | |
| SCHEMBL175923 | 0.70 | — | — | |
| SCHEMBL10829057 | 0.69 | TDP1 (0.30) | — | |
| SCHEMBL1559778 | 0.69 | TDP1 (0.93) | — | |
| Butadiene Epoxide SCHEMBL7754373 | 0.69 | — | — | |
| Butadiene Epoxide SCHEMBL10496505 | 0.69 | — | — | |
| SCHEMBL9203032 | 0.65 | — | — | |
| SCHEMBL508817 | 0.65 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Appears in 2621 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114085492-B | Resin composition, prepreg and laminated board thereof | 苏州生益科技有限公司 | 2023-10-27 | — | — | CN | claimed |
| CN-116948559-A | Preparation method of novel surfactant and application of novel surfactant in adhesive patch | 旭化研(通化)新材料有限公司 | 2023-10-27 | — | — | CN | claimed |
| CN-110050356-B | Composition for organic electronic element encapsulation and encapsulation formed by using composition | 莫门蒂夫性能材料韩国株式会社 | 2023-06-13 | — | — | CN | claimed |
| EP-4021977-B1 | FLAME-RETARDANT POLYCARBONATE COMPOSITION AND MOLDED PARTS AS WELL AS ARTICLES MADE THEREFROM | COVESTRO INTELLECTUAL PROPERTY GMBH & CO KG (DE) | 2023-05-24 | — | — | EP | claimed |
| CN-114686075-B | Solvent-free type natural gas pipeline internal resistance reducing coating and preparation method thereof | 哈尔滨雨阳佳泰环保新材料有限公司 | 2023-04-07 | — | — | CN | claimed |
| CN-109983595-B | Composition for organic electronic device encapsulant and encapsulant formed using the same | 莫门蒂夫性能材料韩国株式会社 | 2023-04-04 | — | — | CN | claimed |
| CN-109791978-B | Composition for organic electronic element encapsulant and encapsulant formed using the same | 莫门蒂夫性能材料韩国株式会社 | 2023-04-04 | — | — | CN | claimed |
| EP-3522241-B1 | COMPOSITION FOR ORGANIC ELECTRONIC ELEMENT ENCAPSULANT, AND ENCAPSULANT FORMED USING SAME | MOMENTIVE PERFORMANCE MAT KOREA CO LTD (KR) | 2023-03-22 | — | — | EP | claimed |
| CN-111224007-B | Light emitting diode and light emitting device having the same | 乐金显示有限公司 | 2023-02-24 | — | — | CN | claimed |
| CN-114729103-A | Polyether modified polybutadiene and preparation method thereof | 赢创运营有限公司 | 2022-07-08 | — | — | CN | claimed |
| US-5114790-A | Polymer blend, carbon black | ACUSHNET COMPANY (US) | 1992-05-19 | — | — | US | claimed |
| US-5021532-A | Modifiers for synthetic polymers | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1991-06-04 | — | — | US | claimed |
| WO-1990012822-A1 | POLYMERS FOR USE IN DRILLING | ALCO CHEMICAL CORPORATION (US) | 1990-11-01 | — | — | WO | claimed |
| EP-0376444-A2 | A thermosetting organic composition | FORD MOTOR COMPANY LIMITED (GB) | 1990-07-04 | — | — | EP | claimed |
| EP-0337814-A2 | Thermoplastic resin composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1989-10-18 | — | — | EP | claimed |
| US-4829120-A | POLYMERIZING A VINYL MONOMER MIXTURE IN PRESENCE OF MACROMER FROM SELF-CONDENSATION OF /2-HYDROXY STEARIC ACID/ | KANSAI PAINT CO., LTD. (JP) | 1989-05-09 | — | — | US | claimed |
| US-4737412-A | BLEND OF ETHYLENE-PROPYLENE-NORBORNADIENE TERPOLYMER WITH POLYETHER OF PROPYLENE GLYCOL AND ALLYL 2,3-DIHYDROXYPROPYL ETHER | ACUSHNET COMPANY (US) | 1988-04-12 | — | — | US | claimed |
| US-4221685-A | Water-dispersed film-forming lacquer containing air-drying alkyd resins and ethylene oxide adducts of hydrophobic compounds | HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN (HENKEL KGAA) (DE) | 1980-09-09 | — | — | US | claimed |
| US-4181685-A | Thermoplastic molding compositions on the basis of polyoxymethylenes | HOECHST AKTIENGESELLSCHAFT (DE) | 1980-01-01 | — | — | US | claimed |
| US-3980734-A | Thermoplastic moulding compositions based on poly (oxymethylene) | HOECHST AKTIENGESELLSCHAFT (DT) | 1976-09-14 | — | — | US | claimed |