SCHEMBL7637726

SCHEMBL7637726

O=C(O)c1ccc(Oc2cccc(Oc3cccc(Oc4ccc(C(=O)O)c(C(=O)O)c4)c3)c2)cc1C(=O)O

nearest known ligand 0.67

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
POLB P06746 3/20 0.67
HPSE Q9Y251 1/20 0.65
KDM4E B2RXH2 1/20 0.60
TDP1 Q9NUW8 4/20 0.57
GALK1 P51570 1/20 0.57
CASP6 P55212 1/20 0.57
MCL1 Q07820 1/20 0.57
PLEC Q15149 1/20 0.57
ALDH1A1 P00352 1/20 0.56
AKR1C3 P42330 2/20 0.53
LMNA P02545 1/20 0.51
DUSP3 P51452 1/20 0.51
PTPN5 P54829 1/20 0.51
PTPN11 Q06124 1/20 0.51
PYGM P11217 4/20 0.49
PYGL P06737 3/20 0.49
MAPK1 P28482 1/20 0.49
GFER P55789 1/20 0.49
APEX1 P27695 1/20 0.49
CTDSP1 Q9GZU7 1/20 0.49

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL140780 1.00 POLB (0.67) POLBHPSEKDM4ETDP1GALK1
SCHEMBL29393214 1.00 POLB (0.67) POLBHPSEKDM4ETDP1GALK1
SCHEMBL522949 0.92 POLB (0.77) POLBHPSEKDM4ETDP1GALK1
SCHEMBL30287662 0.92 POLB (0.77) POLBHPSEKDM4ETDP1GALK1
SCHEMBL2272833 0.92 POLB (0.66) POLBHPSEKDM4ETDP1GALK1
SCHEMBL49365 0.92 POLB (0.70) POLBHPSEKDM4ETDP1GALK1
SCHEMBL29364655 0.92 POLB (0.70) POLBHPSEKDM4ETDP1GALK1
SCHEMBL29426403 0.92 POLB (0.70) POLBHPSEKDM4ETDP1GALK1
SCHEMBL28576596 0.90 POLB (0.75) POLBHPSEKDM4ETDP1GALK1
SCHEMBL10927780 0.90 POLB (0.56) POLBHPSEKDM4ETDP1GALK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20200339754-A1 RESIN COMPOSITION FOR DISPLAY SUBSTRATE, RESIN FILM FOR DISPLAY SUBSTRATE AND LAMINATE BODY CONTAINING THIS, IMAGE DISPLAY DEVICE, ORGANIC EL DISPLAY, AND MANUFACTURING METHOD OF THESE TORAY INDUSTRIES, INC. (JP) 2020-10-29 US disclosed
US-20200207915-A1 RESIN COMPOSITION, METHOD OF PRODUCING RESIN FILM, AND METHOD OF PRODUCING ELECTRONIC DEVICE TORAY INDUSTRIES, INC. (JP) 2020-07-02 US disclosed
US-10590306-B2 Resin composition for display substrate, and heat-resistant resin film, organic EL display substrate, and method for manufacturing organic EL display using same TORAY INDUSTRIES, INC. (JP) 2020-03-17 US disclosed
WO-2019142703-A1 RESIN COMPOSITION FOR DISPLAY SUBSTRATE, RESIN FILM FOR DISPLAY SUBSTRATE AND LAMINATE BODY CONTAINING THIS, IMAGE DISPLAY DEVICE, ORGANIC EL DISPLAY, AND MANUFACTURING METHOD OF THESE 東レ株式会社 2019-07-25 WO disclosed
US-20190055428-A1 RESIN COMPOSITION FOR DISPLAY SUBSTRATE, AND HEAT-RESISTANT RESIN FILM, ORGANIC EL DISPLAY SUBSTRATE, AND METHOD FOR MANUFACTURING ORGANIC EL DISPLAY USING SAME TORAY INDUSTRIES, INC. (JP) 2019-02-21 US disclosed
US-20180362763-A1 RESIN COMPOSITION, METHOD FOR PRODUCING RESIN, METHOD FOR PRODUCING RESIN FILM, AND METHOD FOR PRODUCING ELECTRONIC DEVICE TORAY INDUSTRIES, INC. (JP) 2018-12-20 US disclosed
US-9850347-B2 Polyamic acid resin composition, polyimide film using same, and method for producing said polyimide film TORAY INDUSTRIES, INC. (JP) 2017-12-26 US disclosed
US-9822281-B2 Polyamide acid and resin composition containing same TORAY INDUSTRIES, INC. (JP) 2017-11-21 US disclosed
EP-2881417-B1 POLYAMIDE ACID RESIN COMPOSITION, POLYIMIDE FILM USING SAME, AND METHOD FOR PRODUCING SAID POLYIMIDE FILM TORAY INDUSTRIES (JP) 2017-02-22 EP disclosed
US-20160340547-A1 POLYAMIDE ACID AND RESIN COMPOSITION CONTAINING SAME TORAY INDUSTRIES, INC. (JP) 2016-11-24 US disclosed
US-20150203631-A1 POLYAMIC ACID RESIN COMPOSITION, POLYIMIDE FILM USING SAME, AND METHOD FOR PRODUCING SAID POLYIMIDE FILM TORAY INDUSTRIES, INC. (JP) 2015-07-23 US disclosed
EP-2881417-A1 POLYAMIDE ACID RESIN COMPOSITION, POLYIMIDE FILM USING SAME, AND METHOD FOR PRODUCING SAID POLYIMIDE FILM Toray Industries, Inc. (JP) 2015-06-10 EP disclosed
US-20150045502-A1 POLYAMIDE ACID AND RESIN COMPOSITION CONTAINING SAME TORAY INDUSTRIES, INC. (JP) 2015-02-12 US disclosed
EP-2832769-A1 POLYAMIDE ACID AND RESIN COMPOSITION CONTAINING SAME Toray Industries, Inc. (JP) 2015-02-04 EP disclosed
US-6458912-B1 1,3-BIS(4-AMINOPHENOXY)BENZENE REPRESENTED BY THE CHEMICAL FORMULA (3) FOR PRODUCTION OF THE ABOVE POLYIMIDE, CHARACTERIZED IN THAT THE CONTENT OF AN AZO COMPOUND IS FROM 0.0 TO 0.2%. THE THERMOPLASTIC POLYIMIDE OF THE PRESENT MITSUI CHEMICALS, INC. (JP) 2002-10-01 US disclosed
EP-1090945-A1 CRYSTALLINE POLYIMIDE FOR MELT MOLDING WITH SATISFACTORY THERMAL STABILITY Mitsui Chemicals, Inc. (JP) 2001-04-11 EP disclosed