SCHEMBL140780

SCHEMBL140780

O=C(O)c1ccc(Oc2cccc(Oc3ccc(C(=O)O)c(C(=O)O)c3)c2)cc1C(=O)O

nearest known ligand 0.67

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
POLB P06746 3/20 0.67
HPSE Q9Y251 1/20 0.65
KDM4E B2RXH2 1/20 0.60
TDP1 Q9NUW8 4/20 0.57
GALK1 P51570 1/20 0.57
CASP6 P55212 1/20 0.57
MCL1 Q07820 1/20 0.57
PLEC Q15149 1/20 0.57
ALDH1A1 P00352 1/20 0.56
AKR1C3 P42330 2/20 0.53
LMNA P02545 1/20 0.51
DUSP3 P51452 1/20 0.51
PTPN5 P54829 1/20 0.51
PTPN11 Q06124 1/20 0.51
PYGM P11217 4/20 0.49
PYGL P06737 3/20 0.49
MAPK1 P28482 1/20 0.49
GFER P55789 1/20 0.49
APEX1 P27695 1/20 0.49
CTDSP1 Q9GZU7 1/20 0.49

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29393214 1.00 POLB (0.67) POLBHPSEKDM4ETDP1GALK1
SCHEMBL7637726 1.00 POLB (0.67) POLBHPSEKDM4ETDP1GALK1
SCHEMBL522949 0.92 POLB (0.77) POLBHPSEKDM4ETDP1GALK1
SCHEMBL30287662 0.92 POLB (0.77) POLBHPSEKDM4ETDP1GALK1
SCHEMBL2272833 0.92 POLB (0.66) POLBHPSEKDM4ETDP1GALK1
SCHEMBL49365 0.92 POLB (0.70) POLBHPSEKDM4ETDP1GALK1
SCHEMBL29364655 0.92 POLB (0.70) POLBHPSEKDM4ETDP1GALK1
SCHEMBL29426403 0.92 POLB (0.70) POLBHPSEKDM4ETDP1GALK1
SCHEMBL28576596 0.90 POLB (0.75) POLBHPSEKDM4ETDP1GALK1
SCHEMBL10927780 0.90 POLB (0.56) POLBHPSEKDM4ETDP1GALK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1259 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260132256-A1 POLYAMIC ACID COMPOSITION AND POLYIMIDE PREPARED WITH THE SAME PI ADVANCED MAT CO LTD (KR) 2026-05-14 US claimed
US-20260132262-A1 BLACK POLYIMIDE FILM AND THE MANUFACTURING METHOD THEREOF PI ADVANCED MAT CO LTD (KR) 2026-05-14 US claimed
US-20260125577-A1 SELF-LUBRICATING POLYIMIDE VARNISH AND POLYIMIDE COATING PREPARED THEREFROM PI ADVANCED MAT CO LTD (KR) 2026-05-07 US claimed
US-20260092194-A1 POLYIMIDE VARNISH WITH IMPROVED PULSE ENDURANCE AND POLYIMIDE COATING MATERIAL PREPARED THEREOF PI ADVANCED MAT CO LTD (KR) 2026-04-02 US claimed
EP-4714998-A1 POLYAMIC ACID COMPOSITION WITH IMPROVED ADHESION AND POLYIMIDE CURED PRODUCT COMPRISING THE SAME PI Advanced Materials Co., Ltd. (KR) 2026-03-25 EP claimed
US-20260062517-A1 POLYAMIC ACID COMPOSITION WITH IMPROVED ADHESION AND POLYIMIDE CURED PRODUCT COMPRISING THE SAME PI ADVANCED MAT CO LTD (KR) 2026-03-05 US claimed
US-12522704-B2 Polyimide film having high dimensional stability and manufacturing method therefor PI ADVANCED MATERIALS CO., LTD. (KR) 2026-01-13 US claimed
US-20260008935-A1 POLYIMIDE FILM AND MANUFACTURING METHOD THEREFOR PL ADVANCED MAT CO LTD (KR) 2026-01-08 US claimed
US-12503596-B2 Low-dielectric-constant polyimide composite powder, and method for producing same PI ADVANCED MATERIALS CO., LTD. 2025-12-23 US claimed
EP-4626991-A1 POLYIMIDE VARNISH FOR COATING CONDUCTOR WITH IMPROVED HEAT DISSIPATION FOR COATING CONDUCTOR AND POLYIMIDE COATING MATERIAL COMPRISING THE SAME PI Advanced Materials Co., Ltd. (KR) 2025-10-08 EP claimed
US-20070066765-A1 Polyarlyl ether ketone polymer blends GENERAL ELECTRIC COMPANY (US) 2007-03-22 US claimed
US-6436593-B1 A POLYIMIDE PRECURSOR OR A POLYOXAZOLE PRECURSOR HAVING A GROUP REPRESENTED BY--OR, ACID GENERATION WITH RADIATION HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2002-08-20 US claimed
EP-1089129-A1 Positive type photosensitive resin composition, process for producing pattern and electronic parts Hitachi Chemical DuPont MicroSystems Ltd. (JP) 2001-04-04 EP claimed
US-6117950-A MODIFIED WITH EPOXY RESIN IDEMITSU PETROCHEMICAL COMPANY LIMITED (JP) 2000-09-12 US claimed
EP-0356172-B1 Epoxy resins containing imido rings, production process thereof, and epoxy resin compositions containing the same MITSUI TOATSU CHEMICALS (JP) 1997-01-15 EP claimed
US-4957994-A Epoxy resins containing imido rings, production process thereof and epoxy resin compositions containing the same MITSUI TOATSU CHEMICALS, INC. (JP) 1990-09-18 US claimed
US-4925915-A FLUORINE CONTAINING POLYIMIDES HOECHST CELANESE CORP. (US) 1990-05-15 US claimed
EP-0356172-A2 Epoxy resins containing imido rings, production process thereof, and epoxy resin compositions containing the same MITSUI TOATSU CHEMICALS, Inc. (JP) 1990-02-28 EP claimed
EP-0317944-A2 Polymers prepared from 4,4'-bis-(2-(amino (halo) phenoxyphenyl) hexafluoroisopropyl) diphenyl ether HOECHST CELANESE CORPORATION (US) 1989-05-31 EP claimed
EP-0213573-A2 Crystalline polyimides containing cumulative phenylene sulfide units GENERAL ELECTRIC COMPANY (US) 1987-03-11 EP claimed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (6 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260132262-A1 BLACK POLYIMIDE FILM AND THE MANUFACTURING METHOD THEREOF PARG, PARN, DYNC1LI1 POLB 2367/4885HPSE 3163/4885KDM4E 367/4885
US-20260092194-A1 POLYIMIDE VARNISH WITH IMPROVED PULSE ENDURANCE AND POLYIMIDE COATING MATERIAL PREPARED THEREOF SMURF1, TET1, VCL POLB 1316/4885HPSE 4095/4885KDM4E 661/4885
US-20260062517-A1 POLYAMIC ACID COMPOSITION WITH IMPROVED ADHESION AND POLYIMIDE CURED PRODUCT COMPRISING THE SAME AOC1, AOC2, DDT POLB 1405/4885HPSE 4237/4885KDM4E 2574/4885
US-20260125577-A1 SELF-LUBRICATING POLYIMIDE VARNISH AND POLYIMIDE COATING PREPARED THEREFROM CDH1, PBRM1, ITGA1 POLB 2710/4885HPSE 2623/4885KDM4E 1953/4885
US-20260008935-A1 POLYIMIDE FILM AND MANUFACTURING METHOD THEREFOR MALT1, CDH1, TET1 POLB 3128/4885HPSE 3662/4885KDM4E 226/4885
US-20260132256-A1 POLYAMIC ACID COMPOSITION AND POLYIMIDE PREPARED WITH THE SAME PARG, PARN, PUF60 POLB 2517/4885HPSE 4560/4885KDM4E 1264/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.