Predicted protein targets (top 12)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CES1 | P23141 | 1/20 | 0.45 |
| ▸ | HTT | P42858 | 2/20 | 0.43 |
| ▸ | MEN1 | O00255 | 1/20 | 0.43 |
| ▸ | THRB | P10828 | 1/20 | 0.43 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.43 |
| ▸ | MAPT | P10636 | 1/20 | 0.43 |
| ▸ | USP2 | O75604 | 1/20 | 0.39 |
| ▸ | CES2 | O00748 | 2/20 | 0.38 |
| ▸ | TSHR | P16473 | 1/20 | 0.34 |
| ▸ | PLA2G2C | Q5R387 | 1/20 | 0.34 |
| ▸ | GBA2 | Q9HCG7 | 10/20 | 0.33 |
| ▸ | GBA1 | P04062 | 5/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL790249 | 1.00 | CES1 (0.45) | CES1HTTMEN1THRBKMT2A | |
| SCHEMBL10596203 | 0.97 | CES1 (0.45) | CES1HTTMEN1THRBKMT2A | |
| SCHEMBL625267 | 0.91 | CES1 (0.49) | CES1HTTMEN1THRBKMT2A | |
| SCHEMBL11155708 | 0.88 | CES1 (0.55) | CES1HTTMEN1THRBKMT2A | |
| SCHEMBL19463076 | 0.88 | CES1 (0.55) | CES1HTTMEN1THRBKMT2A | |
| SCHEMBL1238411 | 0.88 | CES1 (0.55) | CES1HTTMEN1THRBKMT2A | |
| SCHEMBL2018151 | 0.88 | CES1 (0.55) | CES1HTTMEN1THRBKMT2A | |
| SCHEMBL4109335 | 0.88 | CES1 (0.55) | CES1HTTMEN1THRBKMT2A | |
| SCHEMBL19463378 | 0.88 | CES1 (0.55) | CES1HTTMEN1THRBKMT2A | |
| SCHEMBL31507425 | 0.88 | CES1 (0.55) | CES1HTTMEN1THRBKMT2A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10882975-B2 | Flameproof, aliphatic polyketone materials, moulded articles produced therefrom and also method for the production thereof | EMS-PATENT AG (CH) | 2021-01-05 | — | — | US | claimed |
| US-20170137608-A1 | FLAMEPROOF, ALIPHATIC POLYKETONE MATERIALS, MOULDED ARTICLES PRODUCED THEREFROM AND ALSO METHOD FOR THE PRODUCTION THEREOF | EMS-PATENT AG (CH) | 2017-05-18 | — | — | US | claimed |
| WO-2002019440-A1 | ENCAPSULANTS FOR SOLID STATE DEVICES | GENERAL ELECTRIC COMPANY (US) | 2002-03-07 | — | — | WO | claimed |
| US-20240218174-A1 | THERMOPLASTIC RESIN COMPOSITION, METHOD OF PREPARING THE SAME, AND MOLDED ARTICLE INCLUDING THE SAME | LG CHEM, LTD. (KR) | 2024-07-04 | — | — | US | disclosed |
| EP-4378999-A1 | THERMOPLASTIC RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND MOLDED ARTICLE INCLUDING SAME | LG Chem, Ltd. (KR) | 2024-06-05 | — | — | EP | disclosed |
| US-20230365753-A1 | POLYAMIDE ELASTOMERS WITH HIGH MELTING POINTS | ASCEND PERFORMANCE MATERIALS OPERATIONS LLC (US) | 2023-11-16 | — | — | US | disclosed |
| EP-4212587-A1 | THERMOPLASTIC RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND MOLDED ARTICLE INCLUDING SAME | LG CHEM, LTD. (KR) | 2023-07-19 | — | — | EP | disclosed |
| US-20230147577-A1 | POLYAMIDE FORMULATIONS FOR LONG TERM HIGH TEMPERATURE PERFORMANCE | ASCEND PERFORMANCE MATERIALS OPERATIONS LLC (US) | 2023-05-11 | — | — | US | disclosed |
| US-20230111455-A1 | THERMOPLASTIC RESIN COMPOSITION, METHOD OF PREPARING THE SAME, AND MOLDED ARTICLE INCLUDING THE SAME | LG CHEM, LTD. (KR) | 2023-04-13 | — | — | US | disclosed |
| EP-3992242-A1 | THERMOPLASTIC RESIN COMPOSITION, PREPARATION METHOD THEREFOR, AND MOLDED ARTICLE COMPRISING SAME | LG Chem, Ltd. (KR) | 2022-05-04 | — | — | EP | disclosed |
| US-20200247994-A1 | POLYAMIDES HAVING HIGH LEVELS OF AMINE END GROUPS | ASCEND PERFORMANCE MATERIALS OPERATIONS LLC (US) | 2020-08-06 | — | — | US | disclosed |
| US-10683418-B2 | Polyamide molding compounds and molded articles produced therefrom | EMS-PATENT AG (CH) | 2020-06-16 | — | — | US | disclosed |
| US-20180171141-A1 | POLYAMIDE MOLDING COMPOUNDS AND MOLDED ARTICLES PRODUCED THEREFROM | EMS-PATENT AG (CH) | 2018-06-21 | — | — | US | disclosed |
| WO-2002019440-A1 | ENCAPSULANTS FOR SOLID STATE DEVICES | GENERAL ELECTRIC COMPANY (US) | 2002-03-07 | — | — | WO | disclosed |