SCHEMBL7667067

SCHEMBL7667067

OCCCn1nnc2ccccc21

nearest known ligand 0.70

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
SLC9A1 P19634 8/20 0.70
EGLN3 Q9H6Z9 2/20 0.61
RAB9A P51151 3/20 0.60
MAPT P10636 2/20 0.60
NPC1 O15118 2/20 0.60
GLA P06280 1/20 0.58
TSHR P16473 1/20 0.58
KDM4E B2RXH2 1/20 0.55
GRM2 Q14416 1/20 0.54
KCNMA1 Q12791 1/20 0.53
MGAM O43451 1/20 0.51
AMY1A P0DUB6 1/20 0.51
GAA P10253 1/20 0.51
SI P14410 1/20 0.51
MGAM2 Q2M2H8 1/20 0.51
P2RX7 Q99572 1/20 0.51
RPS6KA3 P51812 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29482278 1.00 SLC9A1 (0.70) SLC9A1EGLN3RAB9AMAPTNPC1
SCHEMBL7672509 0.95 SLC9A1 (0.71) SLC9A1EGLN3RAB9AMAPTNPC1
SCHEMBL2936169 0.89 SLC9A1 (0.68) SLC9A1EGLN3RAB9AMAPTNPC1
SCHEMBL14796568 0.89 SLC9A1 (0.79) SLC9A1EGLN3RAB9AMAPTNPC1
SCHEMBL31344211 0.84 SLC9A1 (0.59) SLC9A1EGLN3RAB9AMAPTNPC1
SCHEMBL5332501 0.82 SLC9A1 (0.70) SLC9A1EGLN3RAB9AMAPTNPC1
SCHEMBL730645 0.82 SLC9A1 (0.70) SLC9A1EGLN3RAB9AMAPTNPC1
SCHEMBL7667065 0.82 SLC9A1 (0.70) SLC9A1EGLN3RAB9AMAPTNPC1
SCHEMBL7011474 0.82 SLC9A1 (0.70) SLC9A1EGLN3RAB9AMAPTNPC1
SCHEMBL1834794 0.82 SLC9A1 (1.00) SLC9A1EGLN3RAB9AMAPTNPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 56 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118256915-A Flashing etching liquid for seed copper layer and flashing etching method for seed copper layer 上海天承化学有限公司 2024-06-28 CN claimed
US-12493244-B2 Photosensitive resin composition, photosensitive dry film, and pattern formation method SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-12-09 US disclosed
EP-4050054-B1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMATION METHOD SHINETSU CHEMICAL CO (JP) 2025-04-23 EP disclosed
CN-118256915-A Flashing etching liquid for seed copper layer and flashing etching method for seed copper layer 上海天承化学有限公司 2024-06-28 CN disclosed
US-20230305403-A1 PATTERN FORMING METHOD, MANUFACTURING METHOD OF CIRCUIT BOARD, AND LAMINATE FUJIFILM CORPORATION (JP) 2023-09-28 US disclosed
US-20230176479-A1 NEGATIVE RESIST FILM LAMINATE AND PATTERN FORMATION METHOD SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-06-08 US disclosed
CN-116194845-A Photomask, exposure method, method for producing resin pattern, and method for producing photomask 富士胶片株式会社 2023-05-30 CN disclosed
WO-2023090253-A1 LAMINATE, METHOD FOR PRODUCING SAME, AND ELECTRONIC DEVICE 富士フイルム株式会社 2023-05-25 WO disclosed
CN-116149141-A Method for producing resin pattern, method for producing conductive pattern, and laminate 富士胶片株式会社 2023-05-23 CN disclosed
CN-116149136-A Photosensitive composition, laminate, pattern forming method, and patterned laminate 富士胶片株式会社 2023-05-23 CN disclosed
US-9519217-B2 Chemically amplified positive resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-12-13 US disclosed
WO-2016081364-A1 FUSED IMIDAZOLE DERIVATIVES AS TGF-BETA INHIBITORS RIGEL PHARMACEUTICALS, INC. (US) 2016-05-26 WO disclosed
CN-105301905-A Chemically amplified positive resist composition and patterning process SHINETSU CHEMICAL CO 2016-02-03 CN disclosed
EP-2955576-A1 CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION AND PATTERNING PROCESS Shin-Etsu Chemical Co., Ltd. (JP) 2015-12-16 EP disclosed
US-20150355543-A1 CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-12-10 US disclosed
US-8980525-B2 Chemically amplified positive resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-03-17 US disclosed
US-20130026044-A1 CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2013-01-31 US disclosed
EP-2551722-A1 Chemically amplified positive resist composition and patterning process Shin-Etsu Chemical Co., Ltd. (JP) 2013-01-30 EP disclosed
US-6476021-B1 Compounds having cGMP-PDE inhibitory effect MOCHIDA PHARMACEUTICAL CO., LTD. (JP) 2002-11-05 US disclosed
EP-1048666-A1 NOVEL COMPOUNDS HAVING cGMP-PDE INHIBITORY EFFECT MOCHIDA PHARMACEUTICAL CO., LTD. (JP) 2000-11-02 EP disclosed