SCHEMBL7671735

SCHEMBL7671735

CC(C)c1cccc(-c2ccc(N)cc2)c1C(C)C

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA1 P00915 2/20 0.44
CA2 P00918 2/20 0.44
CA12 O43570 1/20 0.44
CA9 Q16790 1/20 0.44
ANPEP P15144 1/20 0.40
GABRA1 P14867 3/20 0.38
GABRG2 P18507 2/20 0.38
GABRB3 P28472 2/20 0.38
CYP3A4 P08684 3/20 0.38
GABRB2 P47870 2/20 0.38
FAAH O00519 1/20 0.38
LMNA P02545 1/20 0.38
CYP1A2 P05177 1/20 0.38
HPGD P15428 1/20 0.38
TSHR P16473 1/20 0.38
GABRB1 P18505 1/20 0.38
PTGS1 P23219 1/20 0.38
SLC6A2 P23975 1/20 0.38
HTR2C P28335 1/20 0.38
GABRA5 P31644 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3689994 0.90 CA1 (0.46) CA1CA2CA12CA9ANPEP
SCHEMBL8637586 0.88 CYP3A4 (0.42) CA1CA2CA12CA9ANPEP
SCHEMBL3697861 0.88 CA1 (0.44) CA1CA2CA12CA9ANPEP
SCHEMBL11312435 0.83 CA1 (0.45) CA1CA2CA12CA9GABRA1
SCHEMBL167079 0.82 CA1 (0.43) CA1CA2CA12CA9GABRA1
SCHEMBL2787589 0.82 CA1 (0.61) CA1CA2CA12CA9ANPEP
SCHEMBL13377202 0.81 CA1 (0.40) CA1CA2CA12CA9ANPEP
SCHEMBL4630689 0.81 GABRA1 (0.47) CA1CA2CA12CA9ANPEP
SCHEMBL29401745 0.81 GABRA1 (0.47) CA1CA2CA12CA9ANPEP
SCHEMBL30808560 0.81 CA1 (0.44) CA1CA2CA12CA9ANPEP

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115380058-A Imide-amic acid copolymer, process for producing the same, varnish, and polyimide film 三菱瓦斯化学株式会社 2022-11-22 CN disclosed
US-6479615-B2 FROM PYROMELLITIC ACID AND A DIAMINO-PHENYL DERIVATIVE LIKE 2,2*-BIS-TRIFLUOROMETHYL-BENZIDENE AND A SECOND AROMATIC DIAMINE; INSULATION ON A METAL FOIL NITTO DENKO CORPORATION (JP) 2002-11-12 US disclosed
US-20010051707-A1 Polyamic acid, polyimide resin obtained therefrom and application thereof to circuit board NITTO DENKO CORPORATION (JP) 2001-12-13 US disclosed
CN-1306025-A Polyamide acid and polyamideous resin prepared therefrom and its use in circuit board NIPPON DENKO (JP) 2001-08-01 CN disclosed
CN-1066770-C Einkomponentige, duroplastisch haertende beschichtungsmasse RAYMOND & CO A (FR) 2001-06-06 CN disclosed