SCHEMBL76752

SCHEMBL76752

[Ni].[V]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28233070 1.00
SCHEMBL28084436 1.00
SCHEMBL352437 0.82
SCHEMBL5072240 0.82
SCHEMBL4754789 0.82
SCHEMBL25304219 0.82
SCHEMBL11139153 0.82
Water SCHEMBL16910272 0.82
SCHEMBL7153885 0.82
SCHEMBL6003971 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 4346 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260150451-A1 WIRING BOARD, FUNCTIONAL BACKPLANE, BACKLIGHT MODULE, DISPLAY PANEL AND DISPLAY APPARATUS BOE TECHNOLOGY GROUP CO., LTD. (CN) 2026-05-28 US claimed
US-20260143588-A1 WIRING BOARD, FUNCTIONAL BACKPLANE AND METHOD FOR MANUFACTURING THE SAME BOE TECH GROUP CO LTD (CN) 2026-05-21 US claimed
CN-122070010-A High-reliability low-stress silicon carbide substrate metallization structure and preparation method thereof 河南微纳半导体科技有限公司 2026-05-19 CN claimed
CN-122013229-A Nickel-vanadium-based composite catalyst and preparation method and application thereof 中国石油化工股份有限公司 2026-05-12 CN claimed
CN-122028550-A Solar cell and photovoltaic module 隆基绿能科技股份有限公司西咸新区分公司 2026-05-12 CN claimed
US-20260123301-A1 WAFER STRUCTURE WITH A CONDUCTIVE COATING LAYER TEXAS INSTRUMENTS INC (US) 2026-04-30 US claimed
US-20260123511-A1 METHOD FOR IMPROVING ADHESION OF A WETTABLE METALLIZATION MULTILAYER IN AN INTEGRATED ELECTRONIC DEVICE STMICROELECTRONICS INTERNATIONAL N.V. (CH) 2026-04-30 US claimed
US-20260096426-A1 HEAT DISSIPATION STRUCTURE FOR INTEGRATED CIRCUIT PACKAGES TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2026-04-02 US claimed
US-20260082908-A1 Heat Dissipating Lid, Chip Package Structure, and Electronic Device HUAWEI TECHNOLOGIES CO., LTD. (CN) 2026-03-19 US claimed
US-20260082975-A1 ELECTRONIC COMPONENT WITH STACKED BARRIER STRUCTURE, INTERMEDIATE STRUCTURE COMPRISING NICKEL, AND COPPER AND/OR ALUMINIUM STRUCTURE INFINEON TECHNOLOGIES AG (DE) 2026-03-19 US claimed
EP-0307457-B1 IMPROVED VAPOR PHASE BROMINATION OF AROMATIC COMPOUNDS EASTMAN KODAK COMPANY (a New Jersey corporation) (US) 1992-11-11 EP claimed
CN-1050401-A PROCESS FOR RECOVERING CATALYTIC CRACKING CATALYST BY REMOVING METALS CHINA PETROCHEMICAL CO (CN) 1991-04-03 CN claimed
US-4909958-A Prevention of formation of nickel subsulfide in partial oxidation of heavy liquid and/or solid fuels TEXACO INC. (US) 1990-03-20 US claimed
EP-0191538-B1 CHIP RESISTOR AND METHOD FOR THE MANUFACTURE THEREOF Koninklijke Philips Electronics N.V. (NL) 1990-01-10 EP claimed
US-4787968-A HYDROCARBON CRACKING CHEMCAT CORPORATION (US) 1988-11-29 US claimed
US-4780702-A Chip resistor and method for the manufacture thereof U.S. PHILIPS CORPORATION (US) 1988-10-25 US claimed
US-4737187-A MIXING WITH ALKALI METAL CARBONATES, MELTING, SEPARATION BY WATER SOLUBILITY GFE GESELLSCHAFT FUR ELEKTRO METALLURGIE MBH (DE) 1988-04-12 US claimed
US-4707246-A Hydrotreating catalyst and process PHILLIPS PETROLEUM COMPANY (US) 1987-11-17 US claimed
US-4623443-A REGENERATION AND REDUCTION OF METAL-COATED CATALYST, HYDROGENATION OF OLEFINS PHILLIPS PETROLEUM COMPANY (US) 1986-11-18 US claimed
US-4574470-A Semiconductor chip mounting system TRILOGY COMPUTER DEVELOPMENT PARTNERS, LTD. (US) 1986-03-11 US claimed