SCHEMBL7680914

SCHEMBL7680914

CC1(CC2CO2)COC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13292021 0.77
SCHEMBL6048412 0.74
SCHEMBL15726689 0.73 TSHR (0.48)
SCHEMBL7673222 0.73 EPHX1 (0.36)
SCHEMBL10155866 0.69 TSHR (0.48)
SCHEMBL13024562 0.67 EPHX1 (0.58)
SCHEMBL31497223 0.66 ALDH1A1 (0.43)
SCHEMBL272618 0.65
SCHEMBL25363579 0.65 CHRM2 (0.34)
SCHEMBL14231683 0.63

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12516211-B2 Ink composition and electronic device including film formed using the ink composition SAMSUNG DISPLAY CO., LTD. (KR) 2026-01-06 US disclosed
US-20240059920-A1 INK COMPOSITION AND ELECTRONIC APPARATUS INCLUDING FILM PREPARED USING INK COMPOSITION SAMSUNG DISPLAY CO., LTD. (KR) 2024-02-22 US disclosed
WO-2024035042-A1 INK COMPOSITION, AND ELECTRONIC DEVICE COMPRISING FILM FORMED USING SAME 삼성디스플레이주식회사 2024-02-15 WO disclosed
US-20230098571-A1 INK COMPOSITION AND ELECTRONIC DEVICE INCLUDING FILM FORMED USING THE INK COMPOSITION SAMSUNG DISPLAY CO., LTD. (KR) 2023-03-30 US disclosed
US-20230095507-A1 INK COMPOSITION AND ELECTRONIC DEVICE INCLUDING FILM FORMED USING THE INK COMPOSITION SAMSUNG DISPLAY CO., LTD. (KR) 2023-03-30 US disclosed
EP-4151698-A1 INK COMPOSITION AND ELECTRONIC DEVICE INCLUDING FILM FORMED USING THE INK COMPOSITION Samsung Display Co., Ltd. (KR) 2023-03-22 EP disclosed
WO-2019188571-A1 CURABLE ADHESIVE COMPOSITION, ADHESIVE SHEET USING CURABLE ADHESIVE COMPOSITION, LAMINATE INCLUDING ADHESIVE SHEET USING CURABLE ADHESIVE COMPOSITION, AND PRODUCTION METHOD FOR LAMINATE INCLUDING ADHESIVE SHEET USING CURABLE ADHESIVE COMPOSITION DIC株式会社 2019-10-03 WO disclosed
EP-2660927-B1 SEALANT COMPOSITION FOR PHOTOELECTRIC CONVERSION ELEMENT THREEBOND FINE CHEMICAL CO LTD (JP) 2018-08-22 EP disclosed
US-9663688-B2 Optical member and ultraviolet-curable adhesive to be used for producing the same NIPPONKAYAKU KABUSHIKIKAISHA (JP) 2017-05-30 US disclosed
US-20150044479-A1 Ultraviolet-Curable Resin Composition NIPPON KAYAKU KABUSHIKIKAISHA (JP) 2015-02-12 US disclosed
US-20140356591-A1 Optical Member and Ultraviolet-Curable Adhesive to Be Used for Producing the Same NIPPON KAYAKU KABUSHIKIKAISHA (JP) 2014-12-04 US disclosed
US-20140320770-A1 OPTICAL MEMBER AND ULTRAVIOLET-CURABLE ADHESIVE TO BE USED FOR PRODUCING THE SAME NIPPONKAYAKU KABUSHIKIKAISHA (JP) 2014-10-30 US disclosed
EP-2660927-A1 SEALANT COMPOSITION FOR PHOTOELECTRIC CONVERSION ELEMENT Threebond Co., Ltd. (JP) 2013-11-06 EP disclosed
US-6406770-B1 MULTILAYER; CONTAINING CATIONIC POLYMER DAINIPPON INK AND CHEMICALS, INC. (JP) 2002-06-18 US disclosed
EP-1005037-A1 OPTICAL DISK AND METHOD OF MANUFACTURING OPTICAL DISK DAINIPPON INK AND CHEMICALS, INC. (JP) 2000-05-31 EP disclosed