SCHEMBL7702464

SCHEMBL7702464

O=C1CCCCOC1=O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8676774 0.97 CA1 (0.52)
SCHEMBL31510311 0.97 CA1 (0.52)
SCHEMBL31510310 0.97 CA1 (0.52)
SCHEMBL165310 0.92
SCHEMBL626215 0.79
SCHEMBL493857 0.78 CA1 (0.53)
SCHEMBL3093303 0.76 CA1 (0.50)
SCHEMBL493682 0.76 CA1 (0.50)
SCHEMBL17672300 0.76 CA1 (0.50)
SCHEMBL9788227 0.76 CA1 (0.50)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11742519-B2 Silicon-based energy storage devices with electrolyte additive compounds ENEVATE CORPORATION (US) 2023-08-29 US claimed
EP-4651192-A2 UNDERLAYER FOR PHOTORESIST ADHESION AND DOSE REDUCTION Lam Research Corporation (US) 2025-11-19 EP disclosed
US-12474638-B2 Underlayer for photoresist adhesion and dose reduction LAM RESEARCH CORPORATION (US) 2025-11-18 US disclosed
US-20250328076-A1 UNDERLAYER FOR PHOTORESIST ADHESION AND DOSE REDUCTION LAM RES CORP (US) 2025-10-23 US disclosed
EP-4591122-A1 BAKE-SENSITIVE UNDERLAYERS TO REDUCE DOSE TO SIZE OF EUV PHOTORESIST Lam Research Corporation (US) 2025-07-30 EP disclosed
US-20250205680-A1 FUNCTIONALIZED AND CROSSLINKED MATERIALS X DEV LLC (US) 2025-06-26 US disclosed
US-20250205683-A1 LIFETIME IMPROVEMENT OF FUNCTIONALIZED MATERIALS X DEV LLC (US) 2025-06-26 US disclosed
US-20250205681-A1 POLYMER REINFORCEMENT ON DOUBLE AMINE COATED SORBENT X DEV LLC (US) 2025-06-26 US disclosed
US-20250060673-A1 DEVELOPMENT STRATEGY FOR HIGH-ABSORBING METAL-CONTAINING PHOTORESISTS LAM RES CORP (US) 2025-02-20 US disclosed
US-20250053092-A1 AQUEOUS ACID DEVELOPMENT OR TREATMENT OF ORGANOMETALLIC PHOTORESIST LAM RES CORP (US) 2025-02-13 US disclosed
EP-4038454-A2 SUBSTRATE SURFACE MODIFICATION WITH HIGH EUV ABSORBERS FOR HIGH PERFORMANCE EUV PHOTORESISTS Lam Research Corporation (US) 2022-08-10 EP disclosed
CN-114730133-A Substrate surface modification with high EUV absorber for high performance EUV photoresists 朗姆研究公司 2022-07-08 CN disclosed
WO-2022119563-A1 COMPOSITION AND METHOD FOR TREATMENT OF ISCHEMIC DISEASE SHIH CHUN CHE 2022-06-09 WO disclosed
US-11314168-B2 Underlayer for photoresist adhesion and dose reduction LAM RESEARCH CORPORATION (US) 2022-04-26 US disclosed
CN-114200776-A Underlayer for photoresist adhesion and dose reduction 朗姆研究公司 2022-03-18 CN disclosed
US-11254786-B2 Multifunctional degradable nanoparticles with control over size and functionalities VANDERBILT UNIVERSITY (US) 2022-02-22 US disclosed
US-20220043334-A1 UNDERLAYER FOR PHOTORESIST ADHESION AND DOSE REDUCTION LAM RESEARCH CORPORATION (US) 2022-02-10 US disclosed
US-20220035247-A1 UNDERLAYER FOR PHOTORESIST ADHESION AND DOSE REDUCTION LAM RESEARCH CORPORATION (US) 2022-02-03 US disclosed
US-6348564-B1 UNSUBSTITUTED OXEPANE-DIONES PREPARED BY OXIDATION OF CYCLOHEXANEDIONES; BIOCOMPATIBILITY, BIODEGRADATION, NONTOXIC SOLVAY (SOCIETE ANONYME) (BE) 2002-02-19 US disclosed
EP-1061078-A1 Cyclic esterketone compounds, processes for the synthesis thereof and process for the preparation of poly(esterketone)polymers SOLVAY (Société Anonyme) (BE) 2000-12-20 EP disclosed