⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Propane SCHEMBL23701107 | 0.74 | — | — | |
| SCHEMBL705125 | 0.74 | — | — | |
| SCHEMBL7202178 | 0.70 | — | — | |
| SCHEMBL296998 | 0.67 | — | — | |
| SCHEMBL23701288 | 0.65 | — | — | |
| SCHEMBL702294 | 0.65 | — | — | |
| SCHEMBL702832 | 0.65 | — | — | |
| SCHEMBL8381790 | 0.63 | — | — | |
| Hydrochloric Acid SCHEMBL11804288 | 0.63 | — | — | |
| SCHEMBL5013312 | 0.63 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10626221-B2 | Method of preparing organosiloxane | DOW SILICONES CORPORATION (US) | 2020-04-21 | — | — | US | disclosed |
| EP-3371244-B1 | METHOD OF PREPARING ORGANOSILOXANE | DOW SILICONES CORP (US) | 2019-10-02 | — | — | EP | disclosed |
| US-20180312639-A1 | METHOD OF PREPARING ORGANOSILOXANE | DOW SILICONES CORPORATION | 2018-11-01 | — | — | US | disclosed |
| US-20170283443-A1 | FLUOROSILICON NITRILE COMPOUNDS | ARKEMA INC. | 2017-10-05 | — | — | US | disclosed |
| US-20160190486-A1 | ORGANIC ELECTROLUMINESCENT MATERIALS AND DEVICES | UNIVERSAL DISPLAY CORPORATION (US) | 2016-06-30 | — | — | US | disclosed |
| WO-2016032792-A1 | FLUOROSILICON NITRILE COMPOUNDS | ARKEMA INC. (US) | 2016-03-03 | — | — | WO | disclosed |
| US-20140342533-A1 | METHOD OF STRAIN AND DEFECT CONTROL IN THIN SEMICONDUCTOR FILMS | APPLIED MATERIALS, INC. | 2014-11-20 | — | — | US | disclosed |
| US-20130280891-A1 | METHOD AND APPARATUS FOR GERMANIUM TIN ALLOY FORMATION BY THERMAL CVD | APPLIED MATERIALS, INC. | 2013-10-24 | — | — | US | disclosed |
| WO-2013158372-A1 | METHOD AND APPARATUS FOR GERMANIUM TIN ALLOY FORMATION BY THERMAL CVD | APPLIED MATERIALS, INC. (US) | 2013-10-24 | — | — | WO | disclosed |
| US-6365528-B1 | PROVIDING REACTOR HAVING A SEMICONDUCTOR SUBSTRATE MOUNTED ON A SUBSTRATE SUPPORT; FORMINGFLUORINE AND CARBON-CONTAINING SILICON OXIDE DIELECTRIC MATERIAL BY REACTING TOGETHER: OXIDIZER AND SILANE COMPOUND | LSI LOGIC CORPORATION | 2002-04-02 | — | — | US | disclosed |