SCHEMBL7736673

SCHEMBL7736673

OC(Br)C1CO1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6425996-B1 ADJUSTING ELECTROCONDUCTIVITY ATOTECH DEUTSCHLAND GMBH (DE) 2002-07-30 US claimed
EP-1042538-B1 AQUEOUS BATH AND METHOD FOR ELECTROLYTIC DEPOSITION OF COPPER COATINGS ATOTECH DEUTSCHLAND GMBH (DE) 2001-07-11 EP claimed
EP-1042538-A2 WATER BATH AND METHOD FOR ELECTROLYTIC DEPOSITION OF COPPER COATINGS ATOTECH Deutschland GmbH (DE) 2000-10-11 EP claimed
WO-1999031300-A2 WATER BATH AND METHOD FOR ELECTROLYTIC DEPOSITION OF COPPER COATINGS ATOTECH DEUTSCHLAND GMBH (DE) 1999-06-24 WO claimed
US-6425996-B1 ADJUSTING ELECTROCONDUCTIVITY ATOTECH DEUTSCHLAND GMBH (DE) 2002-07-30 US disclosed
EP-1042538-B1 AQUEOUS BATH AND METHOD FOR ELECTROLYTIC DEPOSITION OF COPPER COATINGS ATOTECH DEUTSCHLAND GMBH (DE) 2001-07-11 EP disclosed
EP-1042538-A2 WATER BATH AND METHOD FOR ELECTROLYTIC DEPOSITION OF COPPER COATINGS ATOTECH Deutschland GmbH (DE) 2000-10-11 EP disclosed
WO-1999031300-A2 WATER BATH AND METHOD FOR ELECTROLYTIC DEPOSITION OF COPPER COATINGS ATOTECH DEUTSCHLAND GMBH (DE) 1999-06-24 WO disclosed