SCHEMBL7742422

SCHEMBL7742422

OC(Cl)C1CO1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12336470 0.75
Dianhydrogalactitol SCHEMBL8375579 0.72 THRB (0.30)
Dianhydrogalactitol SCHEMBL17264073 0.72 THRB (0.30)
Dianhydrogalactitol SCHEMBL4304284 0.72 THRB (0.30)
Dianhydrogalactitol SCHEMBL4306431 0.72 THRB (0.30)
SCHEMBL622244 0.72
SCHEMBL6007125 0.72
Dianhydrogalactitol SCHEMBL16387832 0.72 THRB (0.30)
Dianhydrogalactitol SCHEMBL21761430 0.72 THRB (0.30)
Dianhydrogalactitol SCHEMBL4307933 0.72 THRB (0.30)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6425996-B1 ADJUSTING ELECTROCONDUCTIVITY ATOTECH DEUTSCHLAND GMBH (DE) 2002-07-30 US claimed
EP-1042538-B1 AQUEOUS BATH AND METHOD FOR ELECTROLYTIC DEPOSITION OF COPPER COATINGS ATOTECH DEUTSCHLAND GMBH (DE) 2001-07-11 EP claimed
EP-1042538-A2 WATER BATH AND METHOD FOR ELECTROLYTIC DEPOSITION OF COPPER COATINGS ATOTECH Deutschland GmbH (DE) 2000-10-11 EP claimed
WO-1999031300-A2 WATER BATH AND METHOD FOR ELECTROLYTIC DEPOSITION OF COPPER COATINGS ATOTECH DEUTSCHLAND GMBH (DE) 1999-06-24 WO claimed
EP-0178580-A2 Intermediates for the synthesis of carboxylic acids ZAMBON S.p.A. (IT) 1986-04-23 EP claimed
US-10982046-B2 Reaction products and use of same in defoamer compositions and methods for defoaming BASF SE 2021-04-20 US disclosed
EP-3166990-B1 REACTION PRODUCTS AND USE OF SAME IN DEFOAMER COMPOSITIONS AND METHODS FOR DEFOAMING BASF SE (DE) 2018-10-24 EP disclosed
US-20170158813-A1 REACTION PRODUCTS AND USE OF SAME IN DEFOAMER COMPOSITIONS AND METHODS FOR DEFOAMING BASF SE (DE) 2017-06-08 US disclosed
EP-3166990-A1 REACTION PRODUCTS AND USE OF SAME IN DEFOAMER COMPOSITIONS AND METHODS FOR DEFOAMING BASF SE (DE) 2017-05-17 EP disclosed
CN-105849148-A Curable compositions that include hydrazide functional materials PPG工业俄亥俄公司 2016-08-10 CN disclosed
CN-103492950-B Photocurable and thermosetting resin composition TAIYO INK MFG. Co.,Ltd. (JP) 2016-04-13 CN disclosed
WO-2016005477-A1 REACTION PRODUCTS AND USE OF SAME IN DEFOAMER COMPOSITIONS AND METHODS FOR DEFOAMING BASF SE (DE) 2016-01-14 WO disclosed
CN-104516201-A Photo-curable resin composition, photo-curable dry film, cured product and printed circuit board TAIYO INK SUZHOU CO LTD 2015-04-15 CN disclosed
CN-104281005-A Curable resin composition, cured product thereof, printed circuit board comprising the same, and method for producing the cured product TAIYO INK MFG CO LTD 2015-01-14 CN disclosed
CN-101970096-B Microcapsules with radiation-induced or thermal release BASF SE (DE) 2014-10-01 CN disclosed
CN-1617710-A Liposome composition for delivery of nucleic acid ALZA CORP (US) 2005-05-18 CN disclosed
US-6425996-B1 ADJUSTING ELECTROCONDUCTIVITY ATOTECH DEUTSCHLAND GMBH (DE) 2002-07-30 US disclosed
EP-1042538-B1 AQUEOUS BATH AND METHOD FOR ELECTROLYTIC DEPOSITION OF COPPER COATINGS ATOTECH DEUTSCHLAND GMBH (DE) 2001-07-11 EP disclosed
EP-1042538-A2 WATER BATH AND METHOD FOR ELECTROLYTIC DEPOSITION OF COPPER COATINGS ATOTECH Deutschland GmbH (DE) 2000-10-11 EP disclosed
WO-1999031300-A2 WATER BATH AND METHOD FOR ELECTROLYTIC DEPOSITION OF COPPER COATINGS ATOTECH DEUTSCHLAND GMBH (DE) 1999-06-24 WO disclosed