Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SLC1A3 | P43003 | 1/20 | 0.31 |
| ▸ | SLC1A2 | P43004 | 1/20 | 0.31 |
| ▸ | SLC1A1 | P43005 | 1/20 | 0.31 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.31 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7759959 | 0.84 | ACE (0.33) | ALDH1A1 | |
| SCHEMBL17617141 | 0.78 | ALDH1A1 (0.43) | ALDH1A1 | |
| SCHEMBL13443753 | 0.78 | SMN1; SMN2 (0.46) | SMN1; SMN2 | |
| SCHEMBL13575648 | 0.78 | ALDH1A1 (0.43) | ALDH1A1 | |
| SCHEMBL2303261 | 0.78 | ALDH1A1 (0.43) | ALDH1A1 | |
| SCHEMBL13443752 | 0.78 | SMN1; SMN2 (0.46) | SMN1; SMN2 | |
| SCHEMBL7433060 | 0.78 | SMN1; SMN2 (0.46) | SMN1; SMN2 | |
| SCHEMBL28106193 | 0.76 | SLC1A3 (0.31) | SLC1A3SLC1A2SLC1A1ALDH1A1SMN1; SMN2 | |
| SCHEMBL15443233 | 0.76 | TSHR (0.40) | SLC1A3SLC1A2SLC1A1ALDH1A1SMN1; SMN2 | |
| SCHEMBL6054130 | 0.75 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1085022-A1 | A method of manufacturing an acyloxysilane compound having functional groups bonded to silicon atoms via Si-C- bonds | Dow Corning Asia, Ltd. (JP) | 2001-03-21 | — | — | EP | disclosed |
| US-6060620-A | Method for manufacturing an acyloxysilane compound having functional groups bonded to silicon atoms via SI--C bonds | DOW CORNING ASIA, LTD. (JP) | 2000-05-09 | — | — | US | disclosed |