Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP1A2 | P05177 | 1/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3184476 | 0.78 | CYP1A2 (0.37) | CYP1A2 | |
| SCHEMBL20561532 | 0.76 | — | — | |
| SCHEMBL9347656 | 0.76 | CYP1A2 (0.39) | CYP1A2 | |
| SCHEMBL27388645 | 0.74 | CYP1A2 (0.38) | CYP1A2 | |
| SCHEMBL109566 | 0.74 | — | — | |
| SCHEMBL28581329 | 0.73 | — | — | |
| SCHEMBL28301284 | 0.72 | — | — | |
| SCHEMBL29419406 | 0.71 | ALDH1A1 (0.31) | — | |
| SCHEMBL570542 | 0.70 | — | — | |
| SCHEMBL994327 | 0.70 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114867796-B | Electrodeposited coating composition containing lamp black pigment | 巴斯夫涂料有限公司 | 2025-01-24 | — | — | CN | disclosed |
| CN-114867796-A | Electrodeposition coating composition containing lampblack pigment | 巴斯夫涂料有限公司 | 2022-08-05 | — | — | CN | disclosed |
| CN-110249016-B | Conductive adhesive | 拓自达电线株式会社 | 2022-01-25 | — | — | CN | disclosed |
| US-10723920-B2 | Conductive adhesive | TATSUTA ELECTRIC WIRE & CABLE CO., LTD. (JP) | 2020-07-28 | — | — | US | disclosed |
| CN-111247215-A | Electrodeposition coating comprising at least one triazine compound | 巴斯夫涂料有限公司 | 2020-06-05 | — | — | CN | disclosed |
| US-20200040231-A1 | Conductive Adhesive | TATSUTA ELECTRIC WIRE & CABLE CO., LTD. (JP) | 2020-02-06 | — | — | US | disclosed |
| CN-1067094-C | Ink compositions | HAYAKAWA RUBBER (JP) | 2001-06-13 | — | — | CN | disclosed |
| EP-0447998-B2 | An aqueous resin composition | TOYO BOSEKI (JP) | 2001-04-11 | — | — | EP | disclosed |
| EP-0447998-B1 | An aqueous resin composition | TOYO BOSEKI (JP) | 1995-10-11 | — | — | EP | disclosed |
| CN-1084193-A | Ink composite | HAYAKAWA RUBBER (JP) | 1994-03-23 | — | — | CN | disclosed |
| EP-0447998-A2 | An aqueous resin composition | Toyo Boseki Kabushiki Kaisha (JP) | 1991-09-25 | — | — | EP | disclosed |