SCHEMBL7781802

SCHEMBL7781802

[Au].[Ni].[Zn]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30474361 0.87
SCHEMBL6471971 0.87
SCHEMBL2170354 0.82
SCHEMBL6839937 0.82
SCHEMBL30577787 0.82
SCHEMBL1188574 0.82
SCHEMBL7774126 0.82
SCHEMBL4305933 0.82
SCHEMBL108635 0.82
SCHEMBL30366848 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12580134-B2 Electrolytic capacitor element having a doped solid electrolyte layer MURATA MANUFACTURING CO., LTD. (JP) 2026-03-17 US disclosed
US-12573562-B2 Solid electrolytic capacitor element, solid electrolytic capacitor, and method for manufacturing solid electrolytic capacitor element MURATA MANUFACTURING CO., LTD. (JP) 2026-03-10 US disclosed
US-12476054-B2 Solid electrolytic capacitor element having a negative conductor layer that does not cover a part of a carbon layer, and solid electrolytic capacitor MURATA MANUFACTURING CO., LTD. (JP) 2025-11-18 US disclosed
US-12424392-B2 Electrolytic capacitor and method for manufacturing electrolytic capacitor MURATA MANUFACTURING CO., LTD. (JP) 2025-09-23 US disclosed
US-12308183-B2 Solid electrolytic capacitor MURATA MANUFACTURING CO., LTD. (JP) 2025-05-20 US disclosed
US-20250149259-A1 SOLID ELECTROLYTIC CAPACITOR ELEMENT, SOLID ELECTROLYTIC CAPACITOR, AND SOLID ELECTROLYTIC CAPACITOR ELEMENT MANUFACTURING METHOD MURATA MANUFACTURING CO., LTD. (JP) 2025-05-08 US disclosed
CN-119487595-A Solid electrolytic capacitor element, solid electrolytic capacitor, and method for manufacturing solid electrolytic capacitor element 株式会社村田制作所 2025-02-18 CN disclosed
US-12087515-B2 Electrolytic capacitor and method for manufacturing electrolytic capacitor MURATA MANUFACTURING CO., LTD. (JP) 2024-09-10 US disclosed
US-20240296997-A1 ELECTROLYTIC CAPACITOR ELEMENT MURATA MANUFACTURING CO., LTD. (JP) 2024-09-05 US disclosed
CN-118318282-A Electrolytic capacitor element 株式会社村田制作所 2024-07-09 CN disclosed
US-20230043077-A1 ELECTROLYTIC CAPACITOR AND METHOD FOR MANUFACTURING ELECTROLYTIC CAPACITOR MURATA MANUFACTURING CO., LTD. (JP) 2023-02-09 US disclosed
US-20230038003-A1 ELECTROLYTIC CAPACITOR AND METHOD FOR MANUFACTURING ELECTROLYTIC CAPACITOR MURATA MANUFACTURING CO., LTD. (JP) 2023-02-09 US disclosed
US-20230028493-A1 ELECTROLYTIC CAPACITOR AND METHOD FOR MANUFACTURING ELECTROLYTIC CAPACITOR MURATA MANUFACTURING CO., LTD. (JP) 2023-01-26 US disclosed
CN-115398576-A Electrolytic capacitor and method for manufacturing electrolytic capacitor 株式会社村田制作所 2022-11-25 CN disclosed
CN-115398577-A Electrolytic capacitor and method for manufacturing electrolytic capacitor 株式会社村田制作所 2022-11-25 CN disclosed
EP-0631324-B1 Method of making ohmic contacts to a complementary semiconductor device MOTOROLA ENERGY SYSTEMS INC (US) 2001-09-26 EP disclosed
US-5480829-A Method of making a III-V complementary heterostructure device with compatible non-gold ohmic contacts MOTOROLA, INC. (US) 1996-01-02 US disclosed
US-5444016-A Method of making ohmic contacts to a complementary III-V semiconductor device NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC. (NL) 1995-08-22 US disclosed
EP-0631323-A1 III-V Complementary heterostructure device with compatible non-gold ohmic contacts MOTOROLA, INC. (US) 1994-12-28 EP disclosed
EP-0631324-A1 Method of making ohmic contacts to a complementary semiconductor device Motorola Energy Systems Inc. (US) 1994-12-28 EP disclosed