SCHEMBL7789651

SCHEMBL7789651

c1ccc2cc(OCC3CO3)c(OCC3CO3)cc2c1

nearest known ligand 0.63

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 1/20 0.63
ALDH1A1 P00352 4/20 0.62
GLA P06280 1/20 0.62
TP53 P04637 3/20 0.61
TSHR P16473 3/20 0.61
HIF1A Q16665 2/20 0.61
CYP3A4 P08684 1/20 0.61
SMN1; SMN2 Q16637 1/20 0.61
MEN1 O00255 2/20 0.49
KMT2A Q03164 2/20 0.49
MAPT P10636 2/20 0.46
HPGD P15428 2/20 0.46
PKM P14618 2/20 0.46
CYP1A2 P05177 1/20 0.46
PPARG P37231 1/20 0.46
LMNA P02545 1/20 0.46
GAA P10253 1/20 0.46
FGFR1 P11362 1/20 0.43
SRC P12931 1/20 0.43
PTPN1 P18031 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29417585 1.00 TDP1 (0.63) TDP1ALDH1A1GLATP53TSHR
SCHEMBL23338288 0.90 TDP1 (0.53) TDP1ALDH1A1GLATP53TSHR
SCHEMBL31120490 0.87 TDP1 (0.58) TDP1ALDH1A1GLATP53TSHR
SCHEMBL8847178 0.84 ALDH1A1 (0.54) TDP1ALDH1A1GLATP53TSHR
SCHEMBL22357196 0.84 ALDH1A1 (0.78) TDP1ALDH1A1GLATP53TSHR
SCHEMBL679937 0.84 ALDH1A1 (0.78) TDP1ALDH1A1GLATP53TSHR
SCHEMBL26656743 0.83 ALDH1A1 (0.57) TDP1ALDH1A1GLATP53TSHR
SCHEMBL3952927 0.83 ALDH1A1 (0.49) TDP1ALDH1A1GLATP53TSHR
SCHEMBL12855148 0.82 TDP1 (0.56) TDP1ALDH1A1GLATP53TSHR
SCHEMBL17912873 0.82 ALDH1A1 (0.59) TDP1ALDH1A1GLATP53TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113056519-B Curable resin composition and curable sheet 长濑化成株式会社 2024-02-23 CN disclosed
CN-117396959-A Recording medium, information recording method, information reading method, and composition for producing recording layer 松下知识产权经营株式会社 2024-01-12 CN disclosed
WO-2023238920-A1 COMPOSITION FOR FORMING RESIST UNDERLAYER FILM TO REDUCE ENVIRONMENTAL IMPACT 日産化学株式会社 2023-12-14 WO disclosed
WO-2023182408-A1 COMPOSITION FOR FORMING RESIST-LOWER-LAYER FILM INCLUDING FLUORENE SKELETON 日産化学株式会社 2023-09-28 WO disclosed
WO-2023181960-A1 COMPOSITION FOR FORMING PROTECTIVE FILM 日産化学株式会社 2023-09-28 WO disclosed
CN-112823177-B Resin composition 纳美仕有限公司 2023-08-15 CN disclosed
WO-2023149327-A1 PROTECTIVE FILM FORMING COMPOSITION 日産化学株式会社 2023-08-10 WO disclosed
US-20220404706-A1 CHEMICAL-RESISTANT POLYVALENT CARBOXYLIC ACID-CONTAINING PROTECTIVE FILM NISSAN CHEMICAL CORPORATION (JP) 2022-12-22 US disclosed
CN-113130438-B Component carrier and method for producing the same 奥特斯(中国)有限公司 2022-12-06 CN disclosed
CN-114839838-A Photosensitive resin composition 味之素株式会社 2022-08-02 CN disclosed
CN-112823177-A Resin composition 纳美仕有限公司 2021-05-18 CN disclosed
WO-2020166580-A1 METHOD FOR PRODUCING POLYMER 日産化学株式会社 2020-08-20 WO disclosed
CN-102568656-B Double-deck anisotropic conductive film and the device comprising this conducting film CHEIL INDUSTRIES INC. (KR) 2016-01-20 CN disclosed
CN-103097460-B Phenolic resin composition, cured relief pattern, and method for producing semiconductor ASAHI KASEI E-MATERIALS CORP. (JP) 2015-10-21 CN disclosed
CN-104945609-A Perfluoroalkylene ether-containing compound and surface protective film FUJI XEROX CO LTD 2015-09-30 CN disclosed
CN-103988127-A Photosensitive resin composition, method for producing cured relief pattern, semiconductor device, and display device ASAHI KASEI E MATERIALS CORP 2014-08-13 CN disclosed
EP-0810249-B1 Thermosetting resin composition, electrically insulated coil, electric rotating machine and method for producing same HITACHI LTD (JP) 2001-11-07 EP disclosed
US-5982056-A STATOR OF ROTATING MACHINE HITACHI, LTD. (JP) 1999-11-09 US disclosed
EP-0810249-A2 Thermosetting resin composition, electrically insulated coil, electric rotating machine and method for producing same HITACHI, LTD. (JP) 1997-12-03 EP disclosed
US-3996284-A Naphthyl and tetrahydronaphthyl di-ethers NAUTA WIJBE THOMAS 1976-12-07 US disclosed