SCHEMBL77899

SCHEMBL77899

CCC(C)CC(C)(C)C(N=C=O)N=C=O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5688622 0.87
SCHEMBL1907962 0.81
SCHEMBL330978 0.80 TRPA1 (0.45)
SCHEMBL810782 0.74
SCHEMBL331182 0.72
SCHEMBL8997371 0.71
SCHEMBL15825726 0.69
SCHEMBL4543709 0.69
SCHEMBL22127282 0.68 TSHR (0.30)
SCHEMBL8521863 0.68

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1956 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12441821-B2 (Meth)acrylate and use thereof MITSUI CHEMICALS, INC. (JP) 2025-10-14 US claimed
US-20250122315-A1 (METH)ACRYLATE AND USE THEREOF MITSUI CHEMICALS, INC. (JP) 2025-04-17 US claimed
US-20250109237-A1 HIGH BIO RENEWABLE CONTENT INKS FOR LAMINATING PRINTING INKS SUN CHEMICAL CORPORATION (NJ) 2025-04-03 US claimed
EP-4511410-A1 HIGH BIO RENEWABLE CONTENT INKS FOR LAMINATING PRINTING INKS Sun Chemical Corporation (US) 2025-02-26 EP claimed
US-20240352172-A1 RADIATION CURABLE COMPOSITIONS FOR ADDITIVE MANUFACTURING OF PARTS WITH HIGH IMPACT RESISTANCE, HIGH DUCTILITY AND HIGH HEAT RESISTANCE EVONIK OPERATIONS GMBH (DE) 2024-10-24 US claimed
EP-4392258-A1 RADIATION CURABLE COMPOSITIONS FOR ADDITIVE MANUFACTURING OF PARTS WITH HIGH IMPACT RESISTANCE, HIGH DUCTILITY AND HIGH HEAT RESISTANCE Evonik Operations GmbH (DE) 2024-07-03 EP claimed
WO-2024099798-A1 RADIATION CURABLE COMPOSITIONS FOR ADDITIVE MANUFACTURING OF HIGH TOUGHNESS ARTICLES EVONIK OPERATIONS GMBH (DE) 2024-05-16 WO claimed
EP-3663370-B1 SOLVENT-CONTAINING COMPOSITION FOR A 2K COATING SYSTEM AND ITS USE DAW SE (DE) 2024-05-01 EP claimed
WO-2024020028-A1 HIGH BIO RENEWABLE CONTENT INKS FOR LAMINATING PRINTING INKS SUN CHEMICAL CORPORATION (US) 2024-01-25 WO claimed
US-20230407132-A1 (METH)ACRYLATE-FUNCTIONAL RADIATION CURABLE COMPOSITIONS FOR ADDITIVE FABRICATION COVESTRO (NETHERLANDS) B.V. (NL) 2023-12-21 US claimed
US-20030125471-A1 Curable resin composition KANSAI PAINT CO., LTD. (JP) 2003-07-03 US claimed
EP-1300429-A1 Curable resin composition KANSAI PAINT CO., LTD. (JP) 2003-04-09 EP claimed
US-20020177653-A1 Water based paint compositions KANSAI PAINT CO., LTD (JP) 2002-11-28 US claimed
EP-0781824-B1 Adhesive for bonding together vinylidene fluoride resin and substrate CENTRAL GLASS CO LTD (JP) 2001-07-25 EP claimed
US-5866222-A Silicone copolymer modified release tapes MINNESOTA MINING AND MANUFACTURING CO. (US) 1999-02-02 US claimed
US-5863657-A COMPRISING AN ELASTIC FLUOROHYDROCRBON RESIN, A POLYISOCYANATE AND ORGANIC SOLVENT; DURABILITY; WEATHERPROOFING; BONDING STRENGTH CENTRAL GLASS COMPANY, LIMITED (JP) 1999-01-26 US claimed
US-5731089-A APPLYING A CATIONICALLY ELECTRODEPOSITION PAINT ON A METALLIC ARTICLE KANSAI PAINT CO., LTD. (JP) 1998-03-24 US claimed
EP-0781824-A1 Adhesive for bonding together vinylidene fluoride resin and substrate CENTRAL GLASS COMPANY, LIMITED (JP) 1997-07-02 EP claimed
US-5389490-A Capsule toner and process for producing the same FUJI XEROX CO., LTD. (JP) 1995-02-14 US claimed
US-3948739-A Coating compositions hardenable by ionization beams BASF FARBEN & FASERN AG (DT) 1976-04-06 US claimed