SCHEMBL780493

SCHEMBL780493

C/C(C(=O)O)=C(/C)C1(C)COC1

nearest known ligand 0.33

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
FFAR3 O14843 1/20 0.33
EPHX1 P07099 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL479261 0.73 ALDH1A1 (0.41) FFAR3
SCHEMBL782171 0.72
SCHEMBL353254 0.72
SCHEMBL7996386 0.72
SCHEMBL14675284 0.69 EPHX1 (0.35) FFAR3EPHX1
SCHEMBL479488 0.68 ALDH1A1 (0.33) FFAR3
Acetic Acid SCHEMBL20745732 0.67 ALDH1A1 (0.32) FFAR3EPHX1
SCHEMBL9956420 0.65
SCHEMBL4188222 0.65
SCHEMBL6897680 0.64 FFAR3 (0.50) FFAR3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 48 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12443101-B2 Cured coating film TAIYO HOLDINGS CO., LTD. (JP) 2025-10-14 US disclosed
US-12313973-B2 Insulating layer for multilayer printed circuit board, multilayer printed circuit board comprising same, and method for producing same LG CHEM, LTD. (KR) 2025-05-27 US disclosed
EP-4502077-A1 CURED PRODUCT, PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, AND PRINTED WIRING BOARD TAIYO HOLDINGS CO., LTD. (JP) 2025-02-05 EP disclosed
US-12043754-B2 Two-component type curable resin composition, product, dry film, cured product, and printed wiring board TAIYO HOLDINGS CO., LTD. (JP) 2024-07-23 US disclosed
EP-3569662-B1 ANTIMICROBIAL POLYMER COATING COMPOSITION AND ANTIMICROBIAL POLYMER FILM LG CHEMICAL LTD (KR) 2022-12-28 EP disclosed
US-20220390844-A1 CURED COATING FILM TAIYO INK MFG. CO., LTD. (JP) 2022-12-08 US disclosed
US-20220325128-A1 TWO-COMPONENT TYPE CURABLE RESIN COMPOSITION, PRODUCT, DRY FILM, CURED PRODUCT, AND PRINTED WIRING BOARD TAIYO INK MFG. CO., LTD. (JP) 2022-10-13 US disclosed
US-20220325126-A1 INSULATING FILM FOR ELECTRONIC COMPONENTS AND METHOD OF PRODUCING INSULATING FILM FOR ELECTRONIC COMPONENTS TAIYO INK MFG. CO., LTD. (JP) 2022-10-13 US disclosed
US-20220279663-A1 INSULATING LAYER FOR MULTILAYER PRINTED CIRCUIT BOARD, MULTILAYER PRINTED CIRCUIT BOARD COMPRISING SAME, AND METHOD FOR PRODUCING SAME LG CHEM, LTD. (KR) 2022-09-01 US disclosed
US-11361878-B2 Method for manufacturing insulating film and semiconductor package LG CHEM, LTD. (KR) 2022-06-14 US disclosed
US-20120111620-A1 PHOTOCURABLE RESIN COMPOSITION TAIYO HOLDINGS CO., LTD. (JP) 2012-05-10 US disclosed
US-20120070780-A1 PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM SOLDER RESIST, AND CIRCUIT BOARD LG CHEM, LTD. (KR) 2012-03-22 US disclosed
US-20110091811-A1 DOUBLE-LAYERED PATTERNABLE ADHESIVE FILM, METHOD OF FORMING THE SAME, AND METHOD OF FORMING PATTERNABLE ADHESIVE LAYER USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2011-04-21 US disclosed
US-20100104810-A1 ORGANIC/INORGANIC COMPOSITE COATING FILM, STRUCTURAL COLOR FILM USING THE SAME, AND PREPARATION METHODS THEREOF KAWAMURA INSTITUTE OF CHEMICAL RESEARCH (JP) 2010-04-29 US disclosed
US-20090311624-A1 RESIST UNDERLAYER FILM FORMING COMPOSITION CONTAINING LIQUID ADDITIVE NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2009-12-17 US disclosed
US-7226721-B2 Underlayer coating forming composition for lithography containing compound having protected carboxyl group NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2007-06-05 US disclosed
US-20060210915-A1 Composition for forming lower layer film for lithography comprising compound having protected carboxyl group NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2006-09-21 US disclosed
EP-1662769-A1 COMPOSITION FOR FORMING LOWER LAYER FILM FOR LITHOGRAPHY COMPRISING COMPOUND HAVING PROTECTED CARBOXYL GROUP Nissan Chemical Industries, Ltd. (JP) 2006-05-31 EP disclosed
WO-2006004171-A1 PHOTOSENSITIVE FILM, PROCESS FOR PRODUCING THE SAME, PROCESS FOR FORMING PERMANENT PATTERN FUJI PHOTO FILM CO., LTD. (JP) 2006-01-12 WO disclosed
WO-2005093793-A1 PROCESS FOR FORMING PERMANENT PATTERN FUJI PHOTO FILM CO., LTD. (JP) 2005-10-06 WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20220279663-A1 INSULATING LAYER FOR MULTILAYER PRINTED CIRCUIT BOARD, MULTILAYER PRINTED CIRCUIT BOARD COMPRISING SAME, AND METHOD FOR PRODUCING SAME MMAB, BMI1, EZH2 FFAR3 4338/4885EPHX1 2808/4885
US-12313973-B2 Insulating layer for multilayer printed circuit board, multilayer printed circuit board comprising same, and method for producing same MMAB, BMI1, EZH2 FFAR3 4338/4885EPHX1 2808/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.