SCHEMBL7882002

SCHEMBL7882002

CCC(N1C(=O)C=CC1=O)N1C(=O)C=CC1=O

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 15/20 0.46
ALDH1A1 P00352 3/20 0.46
BLM P54132 2/20 0.46
LMNA P02545 2/20 0.46
MAPT P10636 2/20 0.46
NPSR1 Q6W5P4 2/20 0.46
GMNN O75496 1/20 0.46
THPO P40225 1/20 0.46
PMP22 Q01453 1/20 0.46
GSK3A P49840 2/20 0.39
GSK3B P49841 2/20 0.39
FAAH O00519 5/20 0.37
PTGS1 P23219 3/20 0.37
PTGS2 P35354 3/20 0.37
HPGD P15428 2/20 0.34
CYP1A2 P05177 1/20 0.34
CYP2C19 P33261 1/20 0.34
WRN Q14191 1/20 0.34
HIF1A Q16665 1/20 0.34
HSP90AA1 P07900 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1703986 0.80 MGLL (0.42) MGLLALDH1A1BLMLMNAMAPT
SCHEMBL1535518 0.79 MGLL (0.46) MGLLALDH1A1BLMLMNAMAPT
SCHEMBL209740 0.77 MGLL (0.44) MGLLALDH1A1BLMLMNAMAPT
SCHEMBL3863566 0.77 MGLL (0.44) MGLLALDH1A1BLMLMNAMAPT
SCHEMBL17924950 0.77 MGLL (0.39) MGLLALDH1A1BLMLMNAMAPT
SCHEMBL4308441 0.77 MGLL (0.45) MGLLALDH1A1BLMLMNAMAPT
SCHEMBL324881 0.75 MGLL (0.42) MGLLALDH1A1BLMLMNAMAPT
SCHEMBL1554094 0.75 MGLL (0.42) MGLLALDH1A1BLMLMNAMAPT
SCHEMBL1887391 0.75 MGLL (0.42) MGLLALDH1A1BLMLMNAMAPT
SCHEMBL9307482 0.75 MGLL (0.42) MGLLALDH1A1BLMLMNAMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023127523-A1 RESIN COMPOSITION, MULTILAYER SHEET, PREPREG, CURED PRODUCT, SUBSTRATE WITH CURED PRODUCT, AND ELECTRONIC DEVICE 東洋インキSCホールディングス株式会社 2023-07-06 WO disclosed
WO-2023112443-A1 HEAT-CURABLE COMPOSITION, ADHESIVE SHEET, PRINTED WIRING BOARD, AND ELECTRONIC APPLIANCE 東洋インキSCホールディングス株式会社 2023-06-22 WO disclosed
CN-102617966-A Process for producing resin varnish containing semi-ipn composite thermosetting resin and, provided using the same, resin varnish for printed wiring board, prepreg and metal-clad laminate HITACHI CHEMICAL CO LTD 2012-08-01 CN disclosed
EP-1070119-A2 IMMOBILIZED NUCLEASE FROM SERRATIA MARCESCENS MERCK PATENT GmbH (DE) 2001-01-24 EP disclosed
US-6025043-A MOLDING AND VULCANIZATION A CHLOROSULFONETHYLENE-ALPHA-OLEFIN COPOLYMER, THIURAM COMPOUND, BISMALEIMIDE AND NICKEL DIALKYLDITHIOCARBAMATE MOTORCAR JOINT BOOT OBTAINED BY MOLDING AND VULCANIZING THE CHLOROSULFONATED ETHYLENE-.ALPHA.-OLEFIN TOSOH CORPORATION (JP) 2000-02-15 US disclosed
WO-1999050397-A2 IMMOBILIZED NUCLEASE FROM SERRATIA MARCESCENS MERCK PATENT GMBH (DE) 1999-10-07 WO disclosed
US-5916977-A TENSILE STRENGTH; RESILIENCE; ROOM TEMPERATURE VULVANIZATION TOSOH CORPORATION (JP) 1999-06-29 US disclosed
EP-0771845-B1 Chlorosulfonated ethylene-alpha-olefin copolymer composition and joint boot using the composition TOSOH CORP (JP) 1999-02-10 EP disclosed
EP-0771845-A1 Chlorosulfonated ethylene-alpha-olefin copolymer composition and joint boot using the composition Tosoh Corporation (JP) 1997-05-07 EP disclosed