⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL23274000 | 0.80 | SLC6A4 (0.31) | — | |
| SCHEMBL5009668 | 0.76 | — | — | |
| SCHEMBL898934 | 0.76 | — | — | |
| SCHEMBL1266379 | 0.70 | — | — | |
| SCHEMBL156086 | 0.69 | AKT1 (0.31) | — | |
| SCHEMBL28227326 | 0.69 | — | — | |
| SCHEMBL21555697 | 0.67 | — | — | |
| SCHEMBL8673638 | 0.67 | — | — | |
| SCHEMBL9684576 | 0.67 | — | — | |
| SCHEMBL20610588 | 0.65 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6197122-B1 | THERMALLY DECOMPOSING ENCAPSULATION AND UNDERFILL TO PROVIDE RESIDUE ON ELECTRONIC COMPONENTS AND DISSOLVING RESIDUE IN POLAR OR BASIC SOLVENT TO EXPOSE ELECTRONIC COMPONENTS | CORNELL RESEARCH FOUNDATION, INC. | 2001-03-06 | — | — | US | disclosed |
| US-5973033-A | CURED THERMOSETS FOR ENCAPSULATION AND UNDERFILL FOR ELECTRONIC COMPONENTS THAT ARE THERMALLY DECOMPOSABLE TO ALLOW REPAIR, REPLACEMENT, RECOVERY OR RECYCLING OF OPERATIVE ELECTRONIC COMPONENTS | CORNELL RESEARCH FOUNDATION, INC. (US) | 1999-10-26 | — | — | US | disclosed |
| US-5948922-A | CROSSLINKING THERMOSETTING RESINS | CORNELL RESEARCH FOUNDATION, INC. (US) | 1999-09-07 | — | — | US | disclosed |