SCHEMBL898934

SCHEMBL898934

OCC1(O)CC=CCC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Methane SCHEMBL7900418 0.76
SCHEMBL23274000 0.75 SLC6A4 (0.31)
SCHEMBL230030 0.72
SCHEMBL17913214 0.69
SCHEMBL13977918 0.68
SCHEMBL8426457 0.68
SCHEMBL156086 0.68 AKT1 (0.31)
SCHEMBL5822827 0.67
Cyclohexane SCHEMBL8748270 0.65
SCHEMBL9684576 0.65

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2621995-B1 ADVANCED EPOXY RESIN COMPOSITIONS DOW GLOBAL TECHNOLOGIES LLC (US) 2016-03-23 EP disclosed
US-9284434-B2 Epoxy resin compositions BLUE CUBE IP LLC (US) 2016-03-15 US disclosed
EP-2621990-B1 THERMOSETTABLE COMPOSITIONS AND THERMOSETS THEREFROM BLUE CUBE IP LLC (US) 2016-02-24 EP disclosed
US-9068039-B2 Thermosettable compositions and thermosets therefrom DOW GLOBAL TECHNOLOGIES LLC (US) 2015-06-30 US disclosed
US-20150152285-A1 ADVANCED EPOXY RESIN COMPOSITIONS BLUE CUBE IP LLC 2015-06-04 US disclosed
US-20140194554-A1 EPOXY RESIN COMPOSITIONS DOW GLOBAL TECHNOLOGIES LLC (US) 2014-07-10 US disclosed
US-20130302336-A1 DISULFIDE STABILIZED DVD-IG MOLECULES UCB PHARMA S.A. (BE) 2013-11-14 US disclosed
US-20130237642-A1 THERMOSETTABLE COMPOSITIONS AND THERMOSETS THEREFROM DOW GLOBAL TECHNOLOGIES LLC (US) 2013-09-12 US disclosed
EP-2621995-A1 ADVANCED EPOXY RESIN COMPOSITIONS Dow Global Technologies LLC (US) 2013-08-07 EP disclosed
EP-2621990-A2 THERMOSETTABLE COMPOSITIONS AND THERMOSETS THEREFROM Dow Global Technologies LLC (US) 2013-08-07 EP disclosed
EP-2621997-A1 ADVANCED POLY EPOXY ESTER RESIN COMPOSITIONS Dow Global Technologies LLC (US) 2013-08-07 EP disclosed
EP-2621994-A1 EPOXY RESIN COMPOSITIONS Dow Global Technologies LLC (US) 2013-08-07 EP disclosed
US-20130178591-A1 ADVANCED POLY EPOXY ESTER RESIN COMPOSITIONS DOW GLOBAL TECHNOLOGIES LLC (US) 2013-07-11 US disclosed
US-20130178590-A1 ADVANCED EPOXY RESIN COMPOSITIONS DOW GLOBAL TECHNOLOGIES LLC (US) 2013-07-11 US disclosed
WO-2012050777-A1 ADVANCED POLY EPOXY ESTER RESIN COMPOSITIONS DOW GLOBAL TECHNOLOGIES LLC (US) 2012-04-19 WO disclosed
WO-2012047420-A2 THERMOSETTABLE COMPOSITIONS AND THERMOSETS THEREFROM DOW GLOBAL TECHNOLOGIES LLC (US) 2012-04-12 WO disclosed
WO-2012044458-A1 ADVANCED EPOXY RESIN COMPOSITIONS DOW GLOBAL TECHNOLOGIES LLC (US) 2012-04-05 WO disclosed
WO-2012044443-A1 EPOXY RESIN COMPOSITIONS DOW GLOBAL TECHNOLOGIES LLC (US) 2012-04-05 WO disclosed