SCHEMBL790563

SCHEMBL790563

C1=C(c2ccccc2OCC2CO2)CCC1

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.53
GLA P06280 1/20 0.53
TDP1 Q9NUW8 1/20 0.45
TP53 P04637 3/20 0.41
TSHR P16473 3/20 0.41
HIF1A Q16665 2/20 0.41
CYP3A4 P08684 1/20 0.41
SMN1; SMN2 Q16637 1/20 0.41
BRD4 O60885 3/20 0.38
MEN1 O00255 2/20 0.37
KMT2A Q03164 2/20 0.37
ADRB2 P07550 1/20 0.35
HTR1A P08908 1/20 0.35
SLC6A2 P23975 1/20 0.35
HTR2A P28223 1/20 0.35
SLC6A4 P31645 1/20 0.35
ADRA1A P35348 1/20 0.35
HTR2B P41595 1/20 0.35
SLC6A3 Q01959 1/20 0.35
ADRA2C P18825 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ethane SCHEMBL28827102 0.97 ALDH1A1 (0.54) ALDH1A1GLATDP1TP53TSHR
SCHEMBL2712808 0.81 ALDH1A1 (0.70) ALDH1A1GLATDP1TP53TSHR
SCHEMBL30525945 0.80 ALDH1A1 (0.68) ALDH1A1GLATDP1TP53TSHR
SCHEMBL11113086 0.80 ALDH1A1 (0.49) ALDH1A1GLATDP1TP53TSHR
SCHEMBL30525943 0.78 ALDH1A1 (0.66) ALDH1A1GLATDP1TP53TSHR
SCHEMBL27849786 0.77 ALDH1A1 (0.41) ALDH1A1GLATDP1TP53TSHR
SCHEMBL29422796 0.77 ALDH1A1 (0.64) ALDH1A1GLATDP1TP53TSHR
SCHEMBL8993129 0.77 ALDH1A1 (0.64) ALDH1A1GLATDP1TP53TSHR
SCHEMBL623648 0.77 ALDH1A1 (0.64) ALDH1A1GLATDP1TP53TSHR
SCHEMBL11111681 0.76 ALDH1A1 (0.51) ALDH1A1GLATDP1TP53TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 156 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2655528-B1 BICOMPONENT REACTIVE INK FOR INK JET PRINTING SICPA HOLDING SA (CH) 2015-02-11 EP claimed
EP-2655528-A1 BICOMPONENT REACTIVE INK FOR INK JET PRINTING OLIVETTI S.p.A. (IT) 2013-10-30 EP claimed
WO-2012084052-A1 BICOMPONENT REACTIVE INK FOR INK JET PRINTING OLIVETTI S.P.A. (IT) 2012-06-28 WO claimed
EP-1893702-B1 CURABLE COMPOSITION AND SUBSTRATES POSSESSING PROTECTIVE LAYER OBTAINED THEREFROM SABIC INNOVATIVE PLASTICS IP (NL) 2011-07-20 EP claimed
US-7622514-B2 curable formualtion containing a functionalized colloidal silica obtained from the reaction of surface hydroxyl groups of colloidal silica with at least one functionalizing silane, an acryalate monomer, a epoxy resin or polyepoxide, acrylate with epoxy functionality, a curing agent ( photoinitiators) SABIC INNOVATIVE PLASTICS IP B.V. (NL) 2009-11-24 US claimed
US-20080160317-A1 Optoelectronic device GELCORE LLC 2008-07-03 US claimed
EP-1899423-A1 CURABLE COMPOSITION AND ARTICLE POSSESSING PROTECTIVE LAYER OBTAINED THEREFROM Momentive Performance Materials Inc. (US) 2008-03-19 EP claimed
EP-1893702-A1 CURABLE COMPOSITION AND SUBSTRATES POSSESSING PROTECTIVE LAYER OBTAINED THEREFROM Momentive Performance Materials Inc. (US) 2008-03-05 EP claimed
EP-1882254-A1 OPTICAL INFORMATION STORAGE MEDIUM POSSESSING A MULTILAYER COATING General Electric Company (US) 2008-01-30 EP claimed
US-20080001140-A1 Optoelectronic device GELCORE LLC 2008-01-03 US claimed
US-20060251901-A1 Curable composition and substrates possessing protective layer obtained therefrom MOMENTIVE PERFORMANCE MATERIALS INC. 2006-11-09 US claimed
US-6878783-B2 Solid state device with encapsulant of cycloaliphatic epoxy resin, anhydride, and boron catalyst GENERAL ELECTRIC COMPANY (US) 2005-04-12 US claimed
US-6809162-B2 A CURABLE BLENDS COMPRISING A CYCLIC POLYMER OF EPOXY RESIN, CURING AGENT HEXAHYDRO-4-METHYLPHTHALIC ANHYDRIDE, BORON COMPOUND HALOGEN-FREE CATALYST; USE FOR PACKAGING A CHIP, LIGHT EMITTING DIODE; RESIST TO HEAT, OXIDATION, RADIATION GENERAL ELECTRIC COMPANY 2004-10-26 US claimed
US-20030208008-A1 Epoxy resin compositions, solid state devices encapsulated therewith and method RUBINSZTAJN MALGORZATA IWONA (US) 2003-11-06 US claimed
US-20030208009-A1 A curable blends comprising a cyclic polymer of epoxy resin, curing agent hexahydro-4-methylphthalic anhydride, boron compound halogen-free catalyst; use for packaging a chip, light emitting diode; resist to heat, oxidation, radiation YEAGER GARY WILLIAM (US) 2003-11-06 US claimed
US-6617400-B2 Free of halogen, and contains at least one cure modifier, and, optionally at least one ancillary curing catalyst; for encapsulating a solid state device GENERAL ELECTRIC COMPANY 2003-09-09 US claimed
US-6617401-B2 Free of halogen, and contains at least one cure modifier, and, optionally at least one ancillary curing catalyst; for encapsulating a solid state device GENERAL ELECTRIC COMPANY 2003-09-09 US claimed
US-20030071368-A1 Epoxy resin compositions, solid state devices encapsulated therewith and method GENERAL ELECTRIC COMPANY 2003-04-17 US claimed
US-20030071367-A1 Epoxy resin compositions, solid state devices encapsulated therewith and method GENERAL ELECTRIC COMPANY 2003-04-17 US claimed
US-6507049-B1 Encapsulants for solid state devices GENERAL ELECTRIC COMPANY 2003-01-14 US claimed