⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2801557 | 0.89 | — | — | |
| SCHEMBL28055442 | 0.89 | — | — | |
| SCHEMBL2801559 | 0.89 | — | — | |
| SCHEMBL29621998 | 0.87 | — | — | |
| SCHEMBL29827703 | 0.87 | — | — | |
| SCHEMBL13724233 | 0.87 | — | — | |
| SCHEMBL4392271 | 0.87 | — | — | |
| SCHEMBL31030164 | 0.87 | — | — | |
| SCHEMBL1857144 | 0.87 | — | — | |
| SCHEMBL1169745 | 0.75 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6210636-B1 | IMPROVED HIGH-TEMPERATURE PROPERTIES, FORMABILITY, TENSILE STRENGTH, DUCTILITY AND WROUGHT CONDITION HARDNESS; ELECTRICAL CONTACTS | THE J. M. NEY COMPANY | 2001-04-03 | — | — | US | disclosed |
| US-6210636-B1 | IMPROVED HIGH-TEMPERATURE PROPERTIES, FORMABILITY, TENSILE STRENGTH, DUCTILITY AND WROUGHT CONDITION HARDNESS; ELECTRICAL CONTACTS | THE J. M. NEY COMPANY | 2001-04-03 | — | — | US | disclosed |
| WO-2000066798-A1 | Cu-Ni-Zn-Pd ALLOYS | THE J.M. NEY COMPANY (US) | 2000-11-09 | — | — | WO | disclosed |
| WO-2000066798-A1 | Cu-Ni-Zn-Pd ALLOYS | THE J.M. NEY COMPANY (US) | 2000-11-09 | — | — | WO | disclosed |
| US-5897673-A | FIBERS HAVING ION EXCHANGEABLE OR ION COORDINATABLE POLAR GROUPS AND CROSSLINKED STRUCTURE, CONTAINING FINE PARTICLES OF INSOLUBLE METAL AND INSOLUBLE METAL SALT; DEODORIZING | JAPAN EXLAN COMPANY LIMITED (JP) | 1999-04-27 | — | — | US | disclosed |