Predicted protein targets (top 18)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 3/20 | 0.52 |
| ▸ | CYP3A4 | P08684 | 3/20 | 0.50 |
| ▸ | MAPT | P10636 | 2/20 | 0.46 |
| ▸ | MEN1 | O00255 | 1/20 | 0.46 |
| ▸ | THRB | P10828 | 1/20 | 0.46 |
| ▸ | HTT | P42858 | 1/20 | 0.46 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.46 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.43 |
| ▸ | HPGD | P15428 | 1/20 | 0.43 |
| ▸ | ADRB2 | P07550 | 1/20 | 0.39 |
| ▸ | ADRB1 | P08588 | 1/20 | 0.39 |
| ▸ | ADRB3 | P13945 | 1/20 | 0.39 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.34 |
| ▸ | RARB | P10826 | 1/20 | 0.34 |
| ▸ | CES2 | O00748 | 1/20 | 0.33 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.33 |
| ▸ | CA1 | P00915 | 1/20 | 0.32 |
| ▸ | CA2 | P00918 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL39603 | 0.85 | TSHR (0.67) | TSHRCYP3A4MAPTMEN1THRB | |
| SCHEMBL217238 | 0.85 | TSHR (0.67) | TSHRCYP3A4MAPTMEN1THRB | |
| SCHEMBL39514 | 0.85 | TSHR (0.67) | TSHRCYP3A4MAPTMEN1THRB | |
| SCHEMBL27130 | 0.85 | TSHR (0.67) | TSHRCYP3A4MAPTMEN1THRB | |
| SCHEMBL1133315 | 0.85 | TSHR (0.67) | TSHRCYP3A4MAPTMEN1THRB | |
| SCHEMBL30673 | 0.85 | TSHR (0.67) | TSHRCYP3A4MAPTMEN1THRB | |
| SCHEMBL988078 | 0.85 | TSHR (0.67) | TSHRCYP3A4MAPTMEN1THRB | |
| SCHEMBL1132722 | 0.85 | TSHR (0.67) | TSHRCYP3A4MAPTMEN1THRB | |
| SCHEMBL8636270 | 0.85 | TSHR (0.67) | TSHRCYP3A4MAPTMEN1THRB | |
| SCHEMBL20733533 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118176231-A | Curable resin composition | 纳美仕有限公司 | 2024-06-11 | — | — | CN | disclosed |
| US-20230383047-A1 | RESIN COMPOSITION, CURED PRODUCT, SEALING MATERIAL, ADHESIVE, INSULATING MATERIAL, COATING MATERIAL, PREPREG, MULTILAYERED BODY, AND FIBER-REINFORCED COMPOSITE MATERIAL | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2023-11-30 | — | — | US | disclosed |
| EP-4282902-A1 | RESIN COMPOSITION, CURED PRODUCT, SEALING MATERIAL, ADHESIVE, INSULATING MATERIAL, COATING MATERIAL, PREPREG, MULTILAYERED BODY, AND FIBER-REINFORCED COMPOSITE MATERIAL | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2023-11-29 | — | — | EP | disclosed |
| US-20230159743-A1 | HEAT-CURABLE EPOXY RESIN COMPOSITION AND HEAT-CURABLE EPOXY RESIN SHEET | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-05-25 | — | — | US | disclosed |
| US-20210108025-A1 | EPOXY RESIN COMPOSITION | NAMICS CORPORATION (JP) | 2021-04-15 | — | — | US | disclosed |
| WO-2021032822-A1 | METHOD FOR COVERING ELONGATED ARTICLES, IN PARTICULAR LINES | TESA SE (DE) | 2021-02-25 | — | — | WO | disclosed |
| WO-2021032727-A1 | METHOD FOR COVERING ELONGATED ARTICLES, IN PARTICULAR LINES | TESA SE (DE) | 2021-02-25 | — | — | WO | disclosed |
| CN-107011514-B | Photoand thermosetting resin composition | 味之素株式会社 | 2020-12-18 | — | — | CN | disclosed |
| CN-101687979-B | Resin composition | AJINOMOTO CO.,INC. (JP) | 2016-03-02 | — | — | CN | disclosed |
| CN-103987754-A | Curable resin composition | THREE BOND CO LTD | 2014-08-13 | — | — | CN | disclosed |
| CN-103739827-A | Resin composition | AJINOMOTO KK | 2014-04-23 | — | — | CN | disclosed |
| CN-103328530-A | Epoxy resin composition and semiconductor sealing material using same | NAMICS CORP | 2013-09-25 | — | — | CN | disclosed |
| CN-102164907-A | Episulfide compound, episulfide compound-containing mixture, method for producing episulfide compound-containing mixture, curable composition, and connection structure | SEKISUI CHEMICAL CO LTD | 2011-08-24 | — | — | CN | disclosed |
| CN-1934158-B | One-component epoxy resin composition | AJINOMOTO KK | 2010-06-09 | — | — | CN | disclosed |
| CN-101687979-A | Resin composition | AJINOMOTO KK | 2010-03-31 | — | — | CN | disclosed |
| CN-101120036-A | Heat-curing type one-pack resin composition | THREE BOND CO LTD (JP) | 2008-02-06 | — | — | CN | disclosed |
| CN-1934158-A | One-component epoxy resin composition | AJINOMOTO KK (JP) | 2007-03-21 | — | — | CN | disclosed |
| CN-1454238-A | Conductive resin composition | AJINOMOTO KK (JP) | 2003-11-05 | — | — | CN | disclosed |
| US-6232426-B1 | BLEND CONTAINING A THIOL, COMPOUND, LATENT CURING AGENT AND BORATE EATER | AJINOMOTO CO., INC. (JP) | 2001-05-15 | — | — | US | disclosed |