SCHEMBL7936337

SCHEMBL7936337

CC(N)CN.[Cu]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9507538 1.00 ALDH1A1 (0.91)
SCHEMBL757716 0.95
SCHEMBL1773428 0.95
SCHEMBL175732 0.95 ALDH1A1 (1.00)
SCHEMBL27327 0.95
Hydrazine SCHEMBL9665685 0.91
Water SCHEMBL5799352 0.91
Hydrochloric Acid SCHEMBL2260838 0.91
Ammonia Solution, Strong SCHEMBL9250838 0.91 ALDH1A1 (0.91)
SCHEMBL9324790 0.91 ALDH1A1 (0.91)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 48 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2000010007-A9 DEVICES AND METHODS FOR ANALYSIS OF NON-IONIC SOLUTES CALIFORNIA INST OF TECHN (US) 2000-07-06 WO claimed
US-6063637-A SENSING MATERIAL OF METAL COMPLEXES HAVING AT LEAST TWO COORDINATION SITES FOR BINDING TARGET AND A DETECTOR FOR MEASURING THE PROTONS OR HYDROXIDE IONS RELEASED FROM THE SENSING MATERIAL WHEN ANALYTE IS BOUND CALIFORNIA INSTITUTE OF TECHNOLOGY (US) 2000-05-16 US claimed
WO-2000010007-A2 DEVICES AND METHODS FOR ANALYSIS OF NON-IONIC SOLUTES CALIFORNIA INSTITUTE OF TECHNOLOGY (US) 2000-02-24 WO claimed
US-12460073-B2 Curable resin composition, fuel cell, and sealing method THREEBOND CO., LTD. (JP) 2025-11-04 US disclosed
US-12325811-B2 Radical-polymerizable adhesive composition for laminating and bonding steel plates, adhesive laminate, motor, and method for manufacturing adhesive laminate THREEBOND CO., LTD. (JP) 2025-06-10 US disclosed
US-20250026968-A1 ANAEROBIC CURING ADHESIVE COMPOSITION, BONDED LAMINATED BODY, MOTOR, AND PRIMER COMPOSITION FOR ANAEROBIC CURING TOAGOSEI CO., LTD. (JP) 2025-01-23 US disclosed
US-20250026967-A1 ANAEROBIC CURING ADHESIVE COMPOSITION, BONDED LAMINATED BODY, AND MOTOR NIPPON STEEL CORPORATION (JP) 2025-01-23 US disclosed
EP-4442783-A1 ANAEROBIC CURING ADHESIVE COMPOSITION, BONDED LAMINATE, MOTOR, AND PRIMER COMPOSITION FOR ANAEROBIC CURING Toagosei Co., Ltd. (JP) 2024-10-09 EP disclosed
EP-4442784-A1 ANAEROBIC CURING-TYPE ADHESIVE COMPOSITION, BONDED LAMINATE, AND MOTOR Toagosei Co., Ltd. (JP) 2024-10-09 EP disclosed
US-20240270934-A1 THERMALLY CONDUCTIVE RESIN COMPOSITION AND CURED PRODUCT THREEBOND CO., LTD. (JP) 2024-08-15 US disclosed
WO-2024135438-A1 ANAEROBIC CURING-TYPE ADHESIVE AGENT COMPOSITION, BONDED LAMINATE, AND MOTOR 東亞合成株式会社 2024-06-27 WO disclosed
EP-3202796-A1 CURABLE RESIN COMPOSITION Three Bond Co., Ltd. (JP) 2017-08-09 EP disclosed
EP-3165584-A1 POLYMERIZABLE SEALING COMPOSITION Threebond Co., Ltd. (JP) 2017-05-10 EP disclosed
US-20170114251-A1 POLYMERIZABLE SEALING COMPOSITION THREEBOND CO., LTD. (JP) 2017-04-27 US disclosed
EP-1013735-B1 ANAEROBICALLY HARDENABLE SEALING COMPOUND COMPOSITION THREE BOND CO LTD (JP) 2001-10-10 EP disclosed
US-6232431-B1 ACRYLATED POLYURETHANE THREE BOND CO., LTD. (JP) 2001-05-15 US disclosed
WO-2000010007-A9 DEVICES AND METHODS FOR ANALYSIS OF NON-IONIC SOLUTES CALIFORNIA INST OF TECHN (US) 2000-07-06 WO disclosed
EP-1013735-A1 ANAEROBICALLY HARDENABLE SEALING COMPOUND COMPOSITION THREE BOND CO., LTD. (JP) 2000-06-28 EP disclosed
US-6063637-A SENSING MATERIAL OF METAL COMPLEXES HAVING AT LEAST TWO COORDINATION SITES FOR BINDING TARGET AND A DETECTOR FOR MEASURING THE PROTONS OR HYDROXIDE IONS RELEASED FROM THE SENSING MATERIAL WHEN ANALYTE IS BOUND CALIFORNIA INSTITUTE OF TECHNOLOGY (US) 2000-05-16 US disclosed
WO-2000010007-A2 DEVICES AND METHODS FOR ANALYSIS OF NON-IONIC SOLUTES CALIFORNIA INSTITUTE OF TECHNOLOGY (US) 2000-02-24 WO disclosed