Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TP53 | P04637 | 1/20 | 0.35 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.35 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.32 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.31 |
| ▸ | GRIA1 | P42261 | 1/20 | 0.30 |
| ▸ | GRIA2 | P42262 | 1/20 | 0.30 |
| ▸ | GRIA3 | P42263 | 1/20 | 0.30 |
| ▸ | GRIA4 | P48058 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30208514 | 0.94 | CYP3A4 (0.35) | TP53TDP1 | |
| SCHEMBL713770 | 0.94 | CYP3A4 (0.35) | TP53TDP1 | |
| SCHEMBL24383847 | 0.87 | ALDH1A1 (0.47) | TDP1ALDH1A1SMN1; SMN2GRIA1GRIA2 | |
| SCHEMBL27481223 | 0.85 | CYP1A2 (0.32) | TP53TDP1 | |
| SCHEMBL5386070 | 0.84 | KDM4E (0.48) | TP53TDP1ALDH1A1 | |
| SCHEMBL13608382 | 0.84 | HPGD (0.32) | — | |
| SCHEMBL16449049 | 0.84 | — | — | |
| SCHEMBL23742539 | 0.84 | ALDH1A1 (0.39) | ALDH1A1 | |
| SCHEMBL9717986 | 0.84 | CD44 (0.41) | ALDH1A1 | |
| SCHEMBL23992470 | 0.81 | ALDH1A1 (0.41) | ALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-120092029-A | Resin composition, cured product, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board | 三菱瓦斯化学株式会社 | 2025-06-03 | — | — | CN | disclosed |
| CN-116891634-A | Curable composition, cured product, prepreg, circuit board, laminated film, semiconductor sealing material, and semiconductor device | DIC株式会社 | 2023-10-17 | — | — | CN | disclosed |
| CN-116891632-A | Curable composition, cured product, prepreg, circuit board, laminate film, semiconductor sealing material, and semiconductor device | DIC株式会社 | 2023-10-17 | — | — | CN | disclosed |
| CN-116891635-A | Curable composition, cured product, prepreg, circuit board, laminated film, semiconductor sealing material, and semiconductor device | DIC株式会社 | 2023-10-17 | — | — | CN | disclosed |
| CN-116891633-A | Curable composition, cured product, prepreg, circuit board, laminate film, semiconductor sealing material, and semiconductor device | DIC株式会社 | 2023-10-17 | — | — | CN | disclosed |
| CN-116135901-A | Epoxy resin | DIC株式会社 | 2023-05-19 | — | — | CN | disclosed |
| CN-115558104-A | Polymaleimide compound, curable composition, cured product, prepreg, circuit board, and build-up film | DIC株式会社 | 2023-01-03 | — | — | CN | disclosed |
| EP-0834499-B1 | Process for the preparation of aromatic vinyl compounds | DAINIPPON INK & CHEMICALS (JP) | 2001-07-25 | — | — | EP | disclosed |
| EP-0834499-A1 | Process for the preparation of aromatic vinyl compounds | DAINIPPON INK AND CHEMICALS, INC. (JP) | 1998-04-08 | — | — | EP | disclosed |