SCHEMBL7943784

SCHEMBL7943784

CCCCC(CC)C(OCC(CO)(CO)CO)c1c(C(C)(C)C)cc(C)cc1C(C)(C)C

nearest known ligand 0.34

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
GAA P10253 1/20 0.33
XBP1 P17861 1/20 0.33
ATM Q13315 1/20 0.33
NPSR1 Q6W5P4 1/20 0.33
L3MBTL1 Q9Y468 1/20 0.33
ALDH1A1 P00352 1/20 0.31
CA2 P00918 1/20 0.31
POLB P06746 1/20 0.31
TYR P14679 1/20 0.31
SMN1; SMN2 Q16637 1/20 0.31
HSPA5 P11021 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11129747 0.89 HSPA5 (0.33) GAAXBP1ATMNPSR1L3MBTL1
SCHEMBL28958848 0.81 GAA (0.31) GAAXBP1ATMNPSR1L3MBTL1
SCHEMBL21753943 0.74 SMN1; SMN2 (0.39) GAAXBP1ATMNPSR1L3MBTL1
SCHEMBL996770 0.72 ATM (0.35) GAAXBP1ATMNPSR1L3MBTL1
SCHEMBL11126013 0.71 SMN1; SMN2 (0.33) ALDH1A1CA2POLBTYRSMN1; SMN2
SCHEMBL14557203 0.68 SMN1; SMN2 (0.46) GAAXBP1ATMNPSR1L3MBTL1
SCHEMBL28350375 0.68 GAA (0.35) GAAXBP1ATMNPSR1L3MBTL1
SCHEMBL1240707 0.67 CYP3A4 (0.32) ALDH1A1CA2POLBTYRSMN1; SMN2
SCHEMBL995780 0.66 CNR2 (0.36) ALDH1A1CA2POLBTYRSMN1; SMN2
SCHEMBL997156 0.66 CNR2 (0.36) ALDH1A1CA2POLBTYRSMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112601776-B Polyamide and polyamide composition 株式会社可乐丽 2024-01-02 CN disclosed
US-20160215124-A1 THERMOPLASTIC RESIN COMPOSITION, RESIN MOLDED ARTICLE, AND METHOD FOR MANUFACTURING THE RESIN MOLDED ARTICLE WITH PLATING LAYER MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2016-07-28 US disclosed
US-6265472-B1 BLEND CONTAINING COPPER PHTHALOCYANINE ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 2001-07-24 US disclosed
US-4371647-A 2,6-Di-tertiary butyl phenyl pentaerythritol spiro bis-phosphites enhancing the stability to heat and light of synthetic resin ADEKA ARGUS CHEMICAL CO. LTD. (JP) 1983-02-01 US disclosed
EP-0038876-A1 2,6-Di-tertiary butyl phenyl pentaerythritol spiro bis-phosphites enhancing the stability to heat and light of synthetic resins, stabilizer compositions comprising phenolic antioxidants and such phosphites, and synthetic resin compositions containing the same ADEKA ARGUS CHEMICAL CO., Ltd. (JP) 1981-11-04 EP disclosed