SCHEMBL798347

SCHEMBL798347

COn1nnc2ccccc21

nearest known ligand 0.58

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.58
NPSR1 Q6W5P4 1/20 0.58
RXFP1 Q9HBX9 1/20 0.58
SLC9A1 P19634 4/20 0.55
KEAP1 Q14145 1/20 0.55
HDAC3 O15379 3/20 0.53
HDAC4 P56524 3/20 0.53
HDAC1 Q13547 3/20 0.53
HDAC7 Q8WUI4 3/20 0.53
HDAC2 Q92769 3/20 0.53
HDAC10 Q969S8 3/20 0.53
HDAC11 Q96DB2 3/20 0.53
HDAC8 Q9BY41 3/20 0.53
HDAC6 Q9UBN7 3/20 0.53
HDAC9 Q9UKV0 3/20 0.53
HDAC5 Q9UQL6 3/20 0.53
KMT2A Q03164 4/20 0.50
POLB P06746 1/20 0.50
MAPK1 P28482 1/20 0.50
ATM Q13315 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17664762 0.84 TSHR (0.54) TSHRNPSR1RXFP1SLC9A1KEAP1
SCHEMBL736439 0.83 TSHR (0.61) TSHRNPSR1RXFP1SLC9A1KEAP1
SCHEMBL29389351 0.83 TSHR (0.61) TSHRNPSR1RXFP1SLC9A1KEAP1
SCHEMBL17110689 0.81 TSHR (0.59) TSHRNPSR1RXFP1SLC9A1KEAP1
SCHEMBL31483487 0.81 TSHR (0.59) TSHRNPSR1RXFP1SLC9A1KEAP1
SCHEMBL23146638 0.80 TSHR (0.54) TSHRNPSR1RXFP1SLC9A1KEAP1
SCHEMBL30381386 0.80 NPSR1 (0.50) TSHRNPSR1RXFP1SLC9A1KEAP1
SCHEMBL9555168 0.80 NPSR1 (0.50) TSHRNPSR1RXFP1SLC9A1KEAP1
SCHEMBL8404027 0.79 TSHR (0.58) TSHRNPSR1RXFP1SLC9A1KEAP1
SCHEMBL21104745 0.79 TSHR (0.58) TSHRNPSR1RXFP1SLC9A1KEAP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 471 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113589662-B Composition, stripping liquid, application of stripping liquid in stripping of photoresist or photoresist residues and stripping method 浙江奥首材料科技有限公司 2022-07-12 CN claimed
CN-113589662-A Composition, stripping liquid, application of stripping liquid in stripping of photoresist or photoresist residues and stripping method 浙江奥首材料科技有限公司 2021-11-02 CN claimed
CN-107221573-B Anti-ultraviolet-aging solar cell back panel film and preparation method thereof 浙江帝恒实业有限公司 2019-06-21 CN claimed
CN-102037157-B Adhesion promotion of metal to laminate with a multi-functional compound ENTHONE 2014-05-28 CN claimed
CN-102037157-A Adhesion promotion of metal to laminate with a multi-functional compound ENTHONE 2011-04-27 CN claimed
CN-1860198-B Non-polymeric organic particles for chemical mechanical polishing DYNEA CHEMICALS OY 2010-06-16 CN claimed
CN-101437919-A CMP method for copper-containing substrates CABOT MICROELECTRONICS CORP (US) 2009-05-20 CN claimed
CN-1860198-A non-polymeric organic particles for chemical mechanical polishing DYNEA CHEMICALS OY (FI) 2006-11-08 CN claimed
US-20030199407-A1 Composition of a resist stripper using electrolytic material with high equivalent conductivity in an aqueous solution DUKSUNG CO., LTD. (KR) 2003-10-23 US claimed
US-20250377594-A1 RESIST COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN AND METHOD FOR PRODUCING PLATED MOLDED ARTICLE SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2025-12-11 US disclosed
US-20250321482-A1 RESIST COMPOSITION, DRY FILM RESIST, METHOD FOR PRODUCING DRY FILM RESIST, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PLATED OBJECT SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2025-10-16 US disclosed
US-20250278022-A1 COMPOUND, POLYMERIC COMPOUND, RESIST COMPOSITION, AND METHOD OF FORMING RESIST PATTERN SAMSUNG ELECTRONICS CO., LTD. (KR) 2025-09-04 US disclosed
US-20250231484-A1 RESIST COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN AND METHOD FOR PRODUCING PLATED MOLDED ARTICLE SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2025-07-17 US disclosed
US-20250197783-A1 PROCESSING SOLUTION, METHOD FOR PROCESSING SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE TOKYO OHKA KOGYO CO., LTD. (JP) 2025-06-19 US disclosed
WO-1998059108-A2 OXIDATION AND BLEACHING SYSTEM WITH ENZYMATICALLY PRODUCED OXIDIZING AGENTS BLUME, HILDEGARD (DE) 1998-12-30 WO disclosed
EP-0393721-A2 Silver halide photographic material FUJI PHOTO FILM CO., LTD. (JP) 1990-10-24 EP disclosed
US-4719248-A BENZOTRIAZOLE UNSATURATED AMIDE BAUSCH & LOMB INCORPORATED (US) 1988-01-12 US disclosed
EP-0221630-A2 Ultraviolet blocking agents for contact lenses BAUSCH & LOMB INCORPORATED (US) 1987-05-13 EP disclosed
EP-0190920-A2 Method of enhancing memory or correcting memory deficiency with arylamido (and arylthioamido)azabicycloalkanes SYNTHELABO (FR) 1986-08-13 EP disclosed
EP-0144087-A2 Heat-developable color light-sensitive material KONICA CORPORATION (JP) 1985-06-12 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20250278022-A1 COMPOUND, POLYMERIC COMPOUND, RESIST COMPOSITION, AND METHOD OF FORMING RESIST PATTERN ABCC1, SLC11A2, RER1 TSHR 4478/4885NPSR1 976/4885RXFP1 973/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.